38 results about "Process alignment" patented technology

The invention discloses an alignment mark and its alignment method. The alignment mark includes a set of main marks formed on a semiconductor substrate, the main mark is composed of N groups of sub-marks, and the N groups of sub-marks Formed in N layers of film layers on the substrate, N is the number of layers that need to be aligned in this photolithography process; each group of sub-marks includes the first sub-mark in the horizontal direction and the second sub-mark in the vertical direction; the The first sub-marks are two groups of gratings in the horizontal direction, and the second sub-marks are two groups of gratings in the vertical direction. In this way, it can be aligned with multiple layers during alignment, thereby improving photolithographic precision and device yield.

A laser process alignment measuring method applicable to a reel-to-reel manufacturing process including a laser process stage, wherein before at least one laser process stage, marks, patterns or surfaces (4,9) are made with printing ink on the base or carrier material of the web (2), and on which the laser beam used can make a mark (7, 10), for example, by removing or changing the printing ink, whereby at the laser process stage, another mark is plotted with the laser beam on the mark et al. printed with printing ink, and the position of the mark et al. printed with printing ink (4, 9) and the mark plotted with the laser (7, 10) are read optically to measure the alignment of the printing ink stage and the laser process stage.

The invention provides a method for adjusting a service flow in open architecture and is applied to network equipment. The network equipment comprises an open application architecture (OAA) board and a main control board, the OAA board comprises an OAA front insertion board and a forwarding rear insertion board; and the OAA front insertion board is used for performing OAA processing on a received message. The method comprises the following steps of: A, detecting whether a single board inserted into the network equipment is an OAA board; and B, after the OAA board is inserted into the network equipment, transmitting a backflow rule of the current board to the OAA front insertion board through a control channel between the main control board and the OAA board, wherein the backflow rule of the current board is used for sending a message processed by the OAA front insertion board to the forwarding rear insertion plate to be processed through an inter-board communication mechanism. By the method, resources on the existing forwarding rear insertion board on the OAA board are well used, and the network equipment does not need an extra OAA proxy board, so that the manufacturing cost of the network equipment is greatly reduced; and moreover, the message processing flow is simplified.

The present invention relates to the technical field of photolithography technology, and in particular to a photolithography process alignment method, which provides a semiconductor substrate to be photoetched, before depositing a high light-absorbing film on the surface of the semiconductor substrate to form a pre-alignment mark. A new alignment mask is etched on the surface of the semiconductor substrate to form a pre-alignment pattern, and then the front-layer alignment operation is performed on the semiconductor substrate based on the pre-alignment marks, and the pre-alignment marks are deposited and formed The topography of the mask is used for alignment, and the alignment light does not need to penetrate the high light-absorbing film layer, avoiding a large amount of light absorption to achieve exposure alignment.

The invention discloses a photoetching alignment method used in a manufacturing process of a semiconductor device. When a process alignment layer or a photoetching alignment mark is not clear while a base layer has a photoetching alignment mark with a concave-convex type step structure, the process alignment layer is subjected to photoetching alignment; the photoetching alignment method used in manufacturing of the semiconductor device comprises a step of forming secondary alignment marks on the process alignment layer after the process alignment layer is formed on the base layer and before the process alignment layer is subjected to photoresist uniformization. By adoption of the photoetching alignment method, the technical problem of difficulty in identifying unclear marks in exposure of many layers caused by complex structure of the semiconductor device in the manufacturing process of the existing semiconductor device can be solved; mark signals with steps and hard to identify can be optimized; and in addition, the execution steps are simple and easy to implement.

The invention discloses a wafer object table temperature control system of a lithography machine and a control method thereof. The temperature control system comprises a silicon wafer object table, a mask plate and a lithography machine light source, as well as a temperature measurement device with a temperature sensor, an element and a computing control system; a silicon wafer holding area and a temperature measurement area are arranged on the silicon wafer object table; the silicon wafer holding area is located at the front end of the temperature measurement area; the temperature measurement device with the temperature sensor is arranged in the temperature measurement area; the element is located between the lithography machine light source and the mask plate; and the temperature measurement device, the computing control system and the element are connected in series to form a temperature control loop. Through the temperature control system and the control method thereof, the temperature of a silicon wafer during exposure can be controlled, which is beneficial to prevent the deformation of the silicon wafer caused by the temperature, so that better process alignment precision can be obtained and high uniformity among silicon wafers and batches during the continuous service of the lithography machine can be realized.