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Conductive substrate and fabricating method thereof, and solar cell

A technology for solar cells and conductive substrates, applied in circuits, photovoltaic power generation, electrical components, etc., can solve the problems of high mass production cost, difficult to control surface etching uniformity, cumbersome and other problems, and achieves a long path and improves photoelectric conversion efficiency. Effect

Inactive Publication Date: 2013-07-03
IND TECH RES INST +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, such a process is not only cumbersome and costly for mass production, but also it is difficult to control the uniformity of surface etching after the large area is enlarged by the above-mentioned wet etching method.

Method used

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  • Conductive substrate and fabricating method thereof, and solar cell
  • Conductive substrate and fabricating method thereof, and solar cell
  • Conductive substrate and fabricating method thereof, and solar cell

Examples

Experimental program
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Effect test

Embodiment Construction

[0056] figure 1 A cross-sectional view of a solar cell prepared according to an embodiment of the present invention. The solar cell 200 includes a conductive substrate 202 according to an embodiment of the present invention, including a substrate 210, a barrier layer 220, and a first electrode layer 230. In the solar cell In an application example, it can further form a solar cell 200 together with a photoelectric conversion layer 240 and a second electrode layer 250 . Such as figure 1 As shown, the substrate 210 has a first surface 210a and a second surface 210b, and the barrier layer 220, the first electrode layer 230, the photoelectric conversion layer 240 and the second electrode layer 250 are sequentially stacked on the first surface 210a of the substrate 210 Above, the photoelectric conversion layer 240 of this embodiment includes stacked layers of PIN structure or stacked layers of NIP structure on the first electrode layer 230 . In particular, in the solar cell 200 o...

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Abstract

A fabricating method of a conductive substrate including the following steps is provided. A substrate is provided. A barrier layer having a first roughened surface is formed on the substrate by an atmospheric pressure plasma process, wherein the surface roughness (Ra) of the first roughened surface formed by the atmospheric pressure plasma process is between 10 nanometers (nm) and 100 nm. A first electrode layer is formed on the first roughened surface of the barrier layer by a vacuum sputter process, wherein a second roughened surface with the surface roughness (Ra) between 10 nm and 100 nm is formed on a surface of the first electrode layer. Furthermore, a photoelectric conversion layer is formed on the second roughened surface of the first electrode layer. A second electrode layer is formed on the photoelectric conversion layer. A solar cell and a conductive substrate are also provided.

Description

technical field [0001] The present invention relates to a conductive substrate, a manufacturing method thereof, and a solar cell, and in particular to a conductive glass substrate with a barrier layer having a roughened surface, a manufacturing method thereof, and a solar cell. Background technique [0002] "Energy" has become one of the important issues that people are actively developing and solving. However, in addition to the depletion of petrochemical energy, the excessive use of petrochemical energy has also brought serious pollution problems. Therefore, the development and application of low-pollution renewable energy will become the only way for human beings to seek sustainable development. At present, the sources of renewable energy can be roughly divided into: solar energy, wind power, hydraulic power, tidal power, geothermal energy, and biomass energy. Among the many types of energy, solar energy is the most valued. The reason is that this type of energy is the m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/18H01L31/0236
CPCH01L31/02168H01L31/022483H01L31/02366Y02E10/50Y10T428/24355
Inventor 张加强吴清吉苏浚贤黄导阳
Owner IND TECH RES INST