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Method for controlling distribution of mesohigh electronic aluminum foil etching holes

An electronic aluminum foil, medium and high voltage technology, applied in the direction of circuits, capacitors, electrical components, etc., can solve the problems of accelerated aluminum foil surface corrosion and thinning, many control factors, complex and cumbersome processes, etc., to achieve increased electrostatic specific capacitance, improved uniformity, The effect of reducing the probability of merging holes

Active Publication Date: 2015-06-17
新疆广投桂东电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Chinese Patent Publication No. 101976612A discloses that a mixed solution of 0.15-0.6mol / L NaOH+0.01-1% ZnO is used as the cleaning and pretreatment solution for aluminum foil, and a layer of zinc is replaced on the surface of the aluminum foil, which can improve the porosity of the aluminum foil to a certain extent. The uniformity and specific capacitance, but because the surface of the aluminum foil and the replaced zinc layer constitute a large number of micro-batteries, it can accelerate the corrosion and thinning of the surface of the aluminum foil
Due to the complex and cumbersome process and many control factors, this technology is still in the laboratory research stage, and there are no reports of mass industrial production.

Method used

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  • Method for controlling distribution of mesohigh electronic aluminum foil etching holes
  • Method for controlling distribution of mesohigh electronic aluminum foil etching holes
  • Method for controlling distribution of mesohigh electronic aluminum foil etching holes

Examples

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Effect test

Embodiment 1

[0030] The specific operation steps are the same as the steps of the method for controlling the pitting distribution of medium and high voltage electronic aluminum foil described above, but the specific control technical conditions are different:

[0031] Preparation of Al with ZnO microspheres on the surface of aluminum foil 2 o 3 Thin-film aluminum foil, ZnO microspheres with a diameter of 0.3 μm, Al 2 o 3 The volume ratio to ZnO is 50:1, and the heat treatment condition is 500°C for 30s. Then, the same porosity corrosion, hole expansion corrosion, post-treatment and 520V chemical conversion treatment were carried out as in the comparative example.

Embodiment 2

[0033] The specific operation steps are the same as the steps of the method for controlling the pitting distribution of medium and high voltage electronic aluminum foil described above, but the specific control technical conditions are different:

[0034] Preparation of Al with ZnO microspheres on the surface of aluminum foil 2 o 3 Thin film of aluminum foil, ZnO microspheres with a diameter of 0.5 μm, Al 2 o 3 The volume ratio to ZnO is 50:1, and the heat treatment condition is 500°C for 30s. Then, the same porosity corrosion, hole expansion corrosion, post-treatment and 520V chemical conversion treatment were carried out as in the comparative example.

Embodiment 3

[0036] The specific operation steps are the same as the steps of the method for controlling the pitting distribution of medium and high voltage electronic aluminum foil described above, but the specific control technical conditions are different:

[0037] Preparation of Al with ZnO microspheres on the surface of aluminum foil 2 o 3 Thin film of aluminum foil, ZnO microspheres with a diameter of 1 μm, Al 2 o 3 The volume ratio to ZnO is 50:1, and the heat treatment condition is 500°C for 30s. Then, the same porosity corrosion, hole expansion corrosion, post-treatment and 520V chemical conversion treatment were carried out as in the comparative example.

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Abstract

The invention discloses a method for controlling the distribution of mesohigh electronic aluminum foil etching holes. According to the method, a layer of Al2O3 film doped with AnO microspheres is prepared on the surface of an aluminum foil to ensure that holes are guided to be uniformly formed in the surface of the aluminum foil. The method specifically comprises the steps of: (1) putting the aluminum foil into alkali lye for soaking treatment; (2) preparing a mixed solution consisting of Al2O3 sol and ZnO microspheres; (3) soaking the aluminum foil subjected to alkaline washing in the mixed solution consisting of the Al2O3 sol and the ZnO microspheres by using a sol-gel dip-coating method, and carrying out heat treatment at 400-500DEG C for 30-300 seconds to form an aluminum foil with a film on the surface of the aluminum foil; and (4) performing tunnel hole corrosion on the aluminum foil with the film. By adopting the method, the uniformity of hole formation of the aluminum foil can be improved, and the probability of hole combination is reduced, so that the electrostatic specific volume of the aluminum foil is improved.

Description

technical field [0001] The invention relates to the technical field of anode foil corrosion for aluminum electrolytic capacitors, in particular to a method for controlling the corrosion hole distribution of medium and high voltage electronic aluminum foils. Background technique [0002] Miniaturization is an inevitable trend in the development of aluminum electrolytic capacitors. Electrolytic corrosion of high-purity aluminum foil with {100} texture to expand its specific surface area and increase specific capacitance is the most effective technical approach for the miniaturization of aluminum electrolytic capacitors. [0003] At present, the electrolytic corrosion process of medium and high pressure aluminum foil generally includes pretreatment, hole corrosion, hole expansion corrosion, and posttreatment. The main function of pretreatment is to remove oil, impurities and oxide film on the surface of the light foil, improve the surface condition, and promote the formation of...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01G9/055C25F3/04
Inventor 梁立勃何业东宋洪洲杨小飞蔡小宇
Owner 新疆广投桂东电子科技有限公司
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