Method and corresponding device for reducing electromagnetic interference at the chip level
An electromagnetic interference and electronic device technology, which is applied to the field of reducing electromagnetic interference at the executive chip level and the corresponding device field. It can solve the problems of unstable components, labor costs, unavailability, and inability to provide services to users, so as to reduce antenna radiation effects and suppress EMI. Effect
Inactive Publication Date: 2016-01-13
MEDIATEK INC
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Problems solved by technology
For example, one EMI solution in the prior art mainly adopts the method of changing the signal path (signalpath) on the printed circuit boards (PCB), which may cause an unacceptable delay in bringing the product to market
As another example, some other EMI solutions in the prior art mainly adopt the method of adding or rearranging (re-arrange) some components on the PCB, which may lead to component instability (uncertainty) and additional material and labor costs
Another example, another EMI solution in the prior art mainly adopts the method of adding shielding material (shielding material) to cover some signal paths on the PCB, which will also result in additional material and labor costs
In short, the existing technology does not serve users well
Method used
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[0023] Certain terms are used in the specification and following claims to refer to particular elements. It should be understood by those skilled in the art that manufacturers may use different terms to refer to the same element. This document does not use the difference in name as a way to distinguish components, but the difference in function of components as a basis for distinction. The "comprising" mentioned throughout the specification and the following claims is an open-ended term, so it should be interpreted as "including but not limited to". In addition, the term "coupled" herein includes any direct and indirect means of electrical connection. Therefore, if it is described that one device is coupled to another device, it means that one device can be directly connected to another device, or indirectly connected to another device through other devices or connection means.
[0024] Please refer to figure 1 , figure 1 It is a block diagram of the device 100 for reduc...
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A method for performing chip level electromagnetic interference (EMI) reduction is provided, where the method is applied to an electronic device. The method includes: providing at least one EMI suppression circuit within at least one chip of the electronic device; and utilizing the at least one EMI suppression circuit within the at least one chip to perform EMI reduction on at least one signal within the at least one chip. In particular, the at least one chip includes a first chip and a second chip; and the at least one EMI suppression circuit includes a first EMI suppression circuit positioned within the first chip, and further includes a second EMI suppression circuit positioned within the second chip. An associated apparatus is also provided.
Description
[0001] Cross References to Related Applications [0002] This application claims priority from US Provisional Application No. 61 / 559,247, filed November 14, 2011, entitled "Chip Level EMI Reduction Method and Apparatus," which is hereby incorporated by reference in its entirety. Priority is also claimed to US Application No. 13 / 676,098, filed November 14, 2012, which is hereby incorporated by reference in its entirety. technical field [0003] The present invention relates to reducing electromagnetic interference (EMI) for electronic devices, and more particularly, relates to a method for reducing EMI at the chip level and a corresponding device. Background technique [0004] Despite various proposed EMI solutions in the prior art, conventional electronic devices still encounter some problems. For example, an EMI solution in the prior art mainly adopts a method of changing signal paths on printed circuit boards (PCBs), which may cause unacceptable delays when products are ...
Claims
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IPC IPC(8): H05K9/00H05K3/00
CPCH05K9/0066
Inventor 余龙昆邓国梁
Owner MEDIATEK INC