A vertical low temperature and low pressure glue injection machine
A low-temperature and low-pressure glue injection machine technology, applied in the field of vertical low-temperature and low-pressure glue injection machines, can solve the problems of poor product quality, shortened service life, and easy pollution of the environment, so as to shorten the development cycle, reduce the defective rate, and The effect of high product precision
Active Publication Date: 2015-12-09
SUZHOU KONIG ELECTRONICS TECH CO LTD
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Problems solved by technology
[0002] In terms of the packaging and protection of precise and sensitive electronic components, sealing glue is a more general method for packaging and protecting such electronic components, but there are great deficiencies in the existing sealing technology, such as glue injection If the pressure is too high, the components will be damaged; after the product is sealed, the sealing performance is poor, which greatly shortens the service life of the product;
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[0013] The preferred embodiments of the present invention are described in detail below, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, so as to define the protection scope of the present invention more clearly.
[0014] The present invention is a vertical low-temperature and low-pressure glue injection machine, see figure 1 As shown, it includes an external frame structure 1 of the glue injection machine, a working unit located on the upper part of the glue injection machine, and a mold clamping cylinder 10 located at the lower part of the glue injection machine and cooperating with the working unit. The working unit includes a gun arranged on the top The frame structure 4 and the frame frame area below the gun frame structure 4, the working direction of the gun frame structure 4 is vertically downward, and the glue melt unit 11 is connected to one side of the glue injection machine.
[0015] The outer f...
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The invention discloses a vertical low-temperature low-pressure glue-injection machine which comprises an outer glue-injection machine frame structure, an operating unit positioned on the upper part of the glue-injection machine, and a die assembly cylinder which is positioned on the lower part of the glue-injection machine and is matched with the operating unit, wherein the operating unit comprises a gun rack structure arranged on the top and a shut die structure below the gun rack structure; the operating direction of the gun rack structure is downwards vertical; and one side of the glue-injection machine is connected with a glue fusing unit. By adopting low-temperature low-pressure glue injection, components are not damaged, the sealing property is high, and the product precision is high, so that the defective rate of the product is greatly reduced, the total production cost is saved, the glue for packaging the product does not contain any solvent and is a non-toxic harmless single-component environment-friendly material; and in addition, according to the equipment, the development cycle is shortened, and the production efficiency is greatly improved.
Description
technical field [0001] The invention relates to the field of packaging and protection of precise and sensitive electronic components, in particular to a vertical low-temperature and low-pressure glue injection machine. Background technique [0002] In terms of the packaging and protection of precise and sensitive electronic components, sealing glue is a more general method for packaging and protecting such electronic components, but there are great deficiencies in the existing sealing technology, such as glue injection If the pressure is too high, the components will be damaged; after the product is sealed, the sealing performance is poor, which greatly shortens the service life of the product; Contents of the invention [0003] The object of the present invention is to provide a vertical low-temperature and low-pressure glue injection machine with low injection pressure, no damage to components, good sealing performance and environmental protection. [0004] The technica...
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IPC IPC(8): B29C45/03
Inventor 朱建晓
Owner SUZHOU KONIG ELECTRONICS TECH CO LTD