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A double-bottom gasket and a mems microphone

A double-bottom gasket and gasket technology, which is applied in the field of microphones, can solve the problems of MEMS diaphragm vibration enhancement and MEMS diaphragm damage, so as to achieve the effect of enhancing reliability and avoiding large impact

Active Publication Date: 2015-11-18
SHANDONG GETTOP ACOUSTIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of this, the present invention provides a kind of double-bottom gasket and a kind of MEMS microphone, to overcome the prior art because when the sound pressure is high, the sound pressure is directly transmitted to the MEMS sheet through the sound hole, making the MEMS diaphragm The vibration is enhanced, causing the problem of damage to the MEMS diaphragm

Method used

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  • A double-bottom gasket and a mems microphone
  • A double-bottom gasket and a mems microphone
  • A double-bottom gasket and a mems microphone

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Embodiment Construction

[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0030] The invention discloses a double-bottom gasket, which comprises: a first gasket and a second gasket, grooves and hole tracks of different sizes are arranged on the first gasket and the second gasket, the second gasket When the first gasket and the second gasket are pasted, the grooves are kept in different directions, and the edges of the first gasket and the second gasket are pasted together with sealant or solder paste, so that the first gasket and the...

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Abstract

The invention discloses a double-bottom gasket comprising a first gasket and a second gasket, wherein the first gasket and the second gasket are provided with grooves and hole paths with different sizes; and in the process of glueing the first gasket and the second gasket, the grooves are kept in different directions, the edges of the first gasket and the second gasket are glued together by use of a sealant or a tin paste, so that the first gasket and the second gasket are fixedly connected, so as to form a cavity with sealed periphery. By virtue of the double layers of gasket, when a larger impact exists in the outside, the impact firstly passes through the cavity formed by the first gasket and the second gasket and then the cavity of an MEMS (Micro Electro Mechanical System) piece, and the cavities have effects of buffering air flow, filtering and damping; when dust enters, the cavities can filter the dust, so that the purpose of effectively protecting the MEMS piece is achieved; and meanwhile, by virtue of adjusting the sizes and paths of holes, a whole MEMS curve can be improved. The invention further discloses an MEMS microphone which is provided with the double-bottom gasket and can be used for effectively preventing the MEMS piece from being subjected to larger impact, and the reliability of the MEMS microphone is enhanced.

Description

technical field [0001] The invention relates to the technical field of microphones, in particular to a double-bottom gasket and a MEMS microphone. Background technique [0002] Microphone, also known as microphone, microphone or microphone, abbreviated as MIC in English, is an electroacoustic device that converts sound waves into electrical signals, and plays a key role in sound reinforcement or recording and broadcasting systems. Microphones include ECM (ElectretCondensorMicrophone, electret condenser microphone) microphones and MEMS (MicroElectroMechanicalsystems, microelectromechanical systems) microphones. MEMS microphones are commonly used now. Please refer to the attached figure 1 It is a schematic structural diagram of an ordinary MEMS microphone, specifically including the following components: wiring board 1, MEMS sheet 2, MEMS sheet packaging glue 3, MEMS diaphragm 4, gold wire 5, ASIC (Application Specific Integrated Circuit, application specific integrated circui...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04R19/04
Inventor 万景明
Owner SHANDONG GETTOP ACOUSTIC