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Transparent polyimide film, its prepolymer and its preparation method

A technology of transparent polyimide and prepolymer, which is applied in the field of transparent polyimide film, can solve the problems of not obtaining high temperature heat resistance, practicability, poor adhesion of resistors, limitation of application fields, etc. The effect of physical properties, high dielectric strength and good light transmittance

Active Publication Date: 2015-08-12
GUANGDONG DANBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] On the other hand, in information and telecommunication devices, broadcasting devices, mobile wireless communications, and high-speed information processing devices, there are high-frequency signal bands (reaching the GHZ band), while modern information devices require flexible and ultra-thin devices that can solve the problem of signal strength. Low, signal transmission delay and other defects, at present, high-frequency circuit films are made of high-frequency compatible polytetrafluoroethylene, because of its poor adhesion to metal conductors and resistors on the surface, and low elastic modulus ("elasticity") "Modulus" is a physical quantity that describes the elasticity of a material. It is a general term, including "Young's modulus" (storage modulus), "shear modulus", "bulk modulus", etc. Therefore, "elastic modulus" and "storage modulus" are inclusive relations), high linear thermal expansion coefficient is not suitable for ultra-dense wiring circuits, and because the high linear thermal expansion coefficient causes scale changes when the temperature changes, its application field is limited. Because of this situation, it has not gained practicality in the field of high temperature heat resistance, high frequency

Method used

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  • Transparent polyimide film, its prepolymer and its preparation method
  • Transparent polyimide film, its prepolymer and its preparation method
  • Transparent polyimide film, its prepolymer and its preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] First purify the sublimation polyanhydride monomer (tetracarboxylic dianhydride, tetracarboxylic boronic acid) and diamine monomer (p-phenylenediamine, o-phenylenediamine, 3.4 diaminodiphenyl ether), according to the aforementioned step 1-2 The preparation is carried out in an organic solvent (N, N', dimethylformamide and N-methyl-ethylpyrrolidone mixture), and the functional polyanhydride derivatives, diamine compounds and prepolymer resins of the present invention are prepared for use.

[0034] Then proceed to step 3-4: in a heating reactor container equipped with nitrogen, thermometer, and vacuum gauge, put polyanhydride derivatives, diamine compounds, and silica gel at a temperature below 30 degrees by 1:1:1 The concentration of the material is adjusted, and the mixture is polymerized by stirring to obtain a transparent polyimide solution with viscosity; then add 3 molar parts of dehydrating agent, 1 molar part mixed catalyst), and cast at a width of 600mm, coat the...

Embodiment 2

[0038] The difference from Example 1 is that the multi-acid anhydride derivatives, the diamine compound and the silica gel are adjusted with a 1:1:2 charging concentration, and the rest are the same, and the main technical indicators of the transparent polyimide are obtained:

[0039]

[0040]

[0041] All indicators can meet the requirements.

Embodiment 3

[0043] The difference from Example 1 is that 3 parts by moles of dehydrating agent and 2 parts by moles of mixed catalyst are added to the polyamic acid solution obtained per 100 parts by moles of moles. Main technical indicators of transparent polyimide:

[0044]

[0045] All indicators can meet the requirements.

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Abstract

The present invention provides a transparent polyimide film obtained by imidization at a low temperature, a pre-polymer solution of the transparent polyimide film, and a preparation method of the transparent polyimide film. A pre-polymer has characteristics of high density, low viscosity, and high storage modulus, and the pre-polymer solution is prepared in the following manner: performing silica gel modification on aromatic diamine and polyacid anhydride, introducing a biphenyl structure, and introducing methyl into aromatic diamine to block complexes, so as to finally achieve transparency of the polyimide film. By means of the method, thermo-tolerant transparent polyimide films with high production efficiency, good modulus mechanical performance, and low thermal expansion coefficient can be obtained. The transparent polyimide film has a structure (I).

Description

technical field [0001] The invention relates to a transparent polyimide film that can be imidized at a relatively low temperature (for example, below 230°C), has a high storage modulus (storage modulus, also known as Young's modulus), and excellent dimensional stability. Its prepolymer, and its preparation method, Background technique [0002] As mankind ushers in the optoelectronic era, optical materials are required for many purposes, such as: visible light transparent materials, transparent materials in the optical communication wavelength close to the infrared field (can be used as optical communication transmission optical fibers), etc. [0003] But in special occasions, more requirements are put forward for transparent materials. For example, as a next-generation surface-mounted substrate, transparent materials require heat resistance above 300°C, which is currently difficult to achieve unless polyimide (PI) films are used. [0004] Due to its excellent heat resistan...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L79/08C08G73/10C08J5/18
CPCC08G73/1067C08G73/1064C08J2379/08C08J5/18
Inventor 刘萍
Owner GUANGDONG DANBOND TECH