Outward bending testing device of microstructural mechanical property sheet

Abstract

The invention discloses an outward bending testing device of a mcrostructural mechanical property sheet. The outward bending testing device comprises a three-dimensional mobile platform, a vibration-proof fixed block, a vibration isolation base, a sample clamping part, a driving part, a load detecting part, a displacement detecting part and a magnifying observing part, wherein the three-dimensional mobile platform is arranged on one side of the vibration isolation base; the vibration-proof fixed block is arranged on the other side of the vibration isolation base; the sample clamping part is arranged on the vibration-proof fixed block; the driving part is arranged on the three-dimensional mobile platform; the load detecting part is connected with the driving part and corresponds to the sample clamping part; the displacement detecting part is arranged between the three-dimensional mobile platform and the vibration-proof fixed block; the magnifying observing part is arranged on the vibration isolation base and is aligned at the sample clamping part. The outward bending testing device has the advantages of simple structure, low manufacture cost and simpleness in clamping and centering, and ensures that the bending mechanical property is efficiently and reliably tested under microscale.

Description

technical field [0001] The invention belongs to a microstructure mechanical performance testing device of a microelectromechanical system, and in particular relates to a microstructure mechanical performance off-chip bending testing device. Background technique [0002] Micromechanical electronic system (MEMS) is a device, device or system developed on the basis of IC technology. It can be mass-produced and integrates microstructures, microsensors, microactuators, microenergy sources, and signal processing and control circuits. At present, the research on the mechanical properties of MEMS materials has lagged far behind the research on its electrical properties and processing technology. The failure and reliability problems caused by the mechanical behavior of MEMS materials have become important factors restricting the development of MEMS technology and the wide application of MEMS products. Therefore, it is necessary to develop testing techniques for the mechanical proper...

AI Technical Summary

Problems solved by technology

However, to build a high-precision off-chip bending test device, not only must consider solving the problems that affect the measurement accuracy, but also consider the structural complexity of the device, cost-effectiveness, and whether it is easy to upgrade.

[0003] At present, foreign microstructure mechanical properties off-chip bending test devices generally have the following characteristics: most of the devices are relatively complicated, and the functional components used are relatively expensive; Problems such as indenter sliding during deflection; some devices have installed too many mechanical structures, introducing unmeasurable factors that affect the measurement results; some devices use nano-indenters for bending tests, and the cost is too high

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