Unlock instant, AI-driven research and patent intelligence for your innovation.

Liquid treatment device

A technology of liquid treatment and liquid treatment, which is applied in the field of liquid treatment equipment, and can solve problems such as difficult cleaning and difficult access of treatment liquid

Active Publication Date: 2017-03-01
TOKYO ELECTRON LTD
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it is difficult for the processing liquid to reach the area held by the holding portion of the wafer, so that it is difficult to perform a cleaning process on this area and its peripheral area.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Liquid treatment device
  • Liquid treatment device
  • Liquid treatment device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, in the accompanying drawings of this specification, for the convenience of illustration and understanding, the actual objects are appropriately reduced in proportion or the ratio of vertical and horizontal dimensions of the actual objects is changed exaggeratedly.

[0020] First, use figure 1 A liquid treatment system including the liquid treatment device according to the embodiment of the present invention will be described.

[0021] Such as figure 1 As shown, the liquid processing system 100 includes: a mounting table 101, which is used to place a carrier, and the carrier accommodates a substrate such as a semiconductor wafer (hereinafter referred to as a wafer W) imported from the outside as a substrate to be processed; The transfer arm 102 is used to take out the wafer W accommodated in the carrier; the rack unit 103 is used to place the wafer W taken o...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention provides a liquid processing device that prevents formation of an untreated area on a substrate that is not subjected to liquid processing. The liquid processing device (10) of the present invention includes: a substrate holding part (21); and a lifting member (50) provided so as to be able to move up and down with respect to the substrate holding part. The substrate holding part includes: a holding base (22); and a first engaging member (31) and a second engaging member (32), which are freely arranged on the holding base and on the periphery of the substrate (W). The first abutting part (55) connected with the first engaging member is in contact with the upper side contacted part (51) of the lifting member In the case of , the first engaging member is located at the engaging position. When the second contact portion (56) connected to the second engagement member is in contact with the lower contacted portion (52) of the lift member, the second engagement member is located at the engagement position.

Description

technical field [0001] The present invention relates to a liquid processing device that performs liquid processing while holding a substrate horizontally. Background technique [0002] In the manufacturing process of semiconductor products and the manufacturing process of flat panel displays (FPD), a process of supplying a processing liquid to a semiconductor wafer or a glass substrate, which is a substrate to be processed, to perform liquid treatment is often used. As such a process, there is, for example, cleaning treatment for removing fine particles, dirt (Japanese: Contaminet-Sion) attached to the substrate, and the like. [0003] As a liquid processing apparatus for performing cleaning processing, it is known to hold a substrate such as a semiconductor wafer on a spin chuck and supply a processing liquid (chemical solution, rinse, etc.) to the upper surface of the wafer while the wafer is horizontally rotated. liquid, etc.) for a single-chip spin cleaning device (for ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L21/687
CPCH01L21/67051H01L21/68728H01L21/68742H01L21/68792H01L21/302B08B3/024
Inventor 江头浩司
Owner TOKYO ELECTRON LTD