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Wire break detection device for multi-wire cutting machine

A multi-wire cutting machine and broken wire detection technology, which is applied to measuring devices, material analysis through electromagnetic means, instruments, etc., can solve the problems of not being thrown onto the baffle, metal wires being evacuated and processed parts being scrapped, economic losses, etc.

Active Publication Date: 2016-08-10
JIANGSU XIEXIN SILICON MATERIAL TECH DEV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The wire break detection device of the traditional multi-wire cutting machine detects the wire breakage through the guide wheel baffle when the metal wire breaks. In one piece, if it cannot be thrown onto the baffle plate, the disconnection alarm cannot be triggered, resulting in the scrapping of the metal wire evacuated parts and the damage of the polyurethane layer of the guide wheel, which will cause great economic losses.

Method used

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  • Wire break detection device for multi-wire cutting machine
  • Wire break detection device for multi-wire cutting machine
  • Wire break detection device for multi-wire cutting machine

Examples

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Embodiment Construction

[0019] Please refer to figure 1 , the present embodiment provides a wire breakage detection device 100 for a multi-wire cutting machine, which is used to detect broken cutting wires on the cutting wire net. The U-shaped bar 110 and the fixing plate 120 fixedly connect the U-shaped bar 110 to the casing (not shown) of the multi-wire cutting machine. It is well known in the industry that the guide wheels of the multi-wire cutting machine are used in pairs. As far as one of the guide wheels is concerned, the side of the guide wheel opposite to the other guide wheel is the inner side, and the side away from the other guide wheel is the outer side. The cutting wire net is wound back and forth on the two guide wheels, that is, it is arranged between the inner sides of the two guide wheels for cutting silicon ingots.

[0020] Please refer to figure 2 , the fixing plate 120 is roughly L-shaped, one end is connected to the U-shaped rod 110, the other end is connected to the casing, ...

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Abstract

The invention relates to a wire breakage detection device of a multi-wire cutting machine, which comprises a detection rod arranged on the outside of the lower side of a guide wheel wound with a cutting wire net, and the detection rod is arranged in a direction consistent with the axial direction of the guide wheel. On one side of the axis of the guide wheel, both ends of the detection rod are connected with connecting rods, and the connecting rods are connected with the casing of the multi-wire cutting machine and grounded through the casing. The wire breakage detection device of the above-mentioned multi-wire cutting machine is provided with a detection rod which occupies a small space under the guide wheel, and a small distance can be set between the detection rod and the guide wheel, so that the detection rod can contact the broken wire in time, and the alarm sensitivity is increased.

Description

technical field [0001] The invention relates to the technical field of cutting equipment in the manufacture of photovoltaic silicon wafers, in particular to a wire break detection device for a multi-wire cutting machine. Background technique [0002] Multi-wire cutting machine cutting technology is a relatively advanced slicing processing technology in the world. Its principle is to use a high-speed moving metal wire to carry mortar to frictionally cut hard and brittle materials such as semiconductors at high speed, so as to achieve the cutting effect. During the whole cutting process, the metal wire is guided by the main wire wheel, the tension wheel, and the wire arranging wheel, and the metal wire is evenly wound on the winding guide wheel. Wire system, a wire cutting net is formed on the main pulley, and hard and brittle materials such as semiconductors to be processed are installed and locked on the cutting table, and the cutting head realizes feeding and cutting throug...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N27/00
Inventor 孟磊磊严路夫陈绍明
Owner JIANGSU XIEXIN SILICON MATERIAL TECH DEV