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Method for raising contraposition precision between printed circuit board and film

A printed circuit board, film alignment technology, used in printed circuits, printed circuit manufacturing, electrical components, etc., can solve the problems of waste boards, slow speed, labor consumption, etc.

Inactive Publication Date: 2013-09-25
吴子坚
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] When the existing printed circuit board is exposed, the phenanthrene board is pasted on the surface of the printed circuit board and then exposed. Because the position between the phenanthrene board and the printed circuit board is sometimes inaccurate, the circuit after exposure is not as preset It is required to be printed on the surface of the printed circuit board to form a waste board, and the speed of affixing the film to the surface of the printed circuit board is slow and labor-intensive

Method used

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Examples

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Effect test

Embodiment

[0008] An embodiment, a method for improving the alignment accuracy of a printed circuit board and a film, A. The printed circuit board drawing and the film drawing are pasted together in the computer, and the positioning holes around the printed circuit board drawing are positioned at Draw the positioning hole on the film drawing; B use a punching machine to punch out the positioning hole around the film according to the position of the positioning hole on the film drawing. The diameter of the positioning hole is 3.175mm. Diameter; C. After the printed circuit board is electroplated, the aperture of the positioning hole of the printed circuit board is punched to be consistent with the aperture of the film positioning hole; D. Press the screw into the film positioning hole, and then attach the film to the surface of the printed circuit board , One end of the screw penetrates into the positioning hole of the printed circuit board to complete the alignment and lamination of the p...

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PUM

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Abstract

The invention relates to a method for raising contraposition precision between a printed circuit board and a film. The method comprises the following steps of: A. fitting a printed circuit board drawing and a film drawing together in a computer, and drawing positioning holes on the film drawing by the position of positioning holes on the circumference of the printed circuit board drawing; B. punching positioning holes on the circumference of the film by a punching machine based on the position of the positioning holes on the film drawing, wherein the diameter of the positioning holes punched on the film are larger than the diameter of the positioning holes on the circumference of the printed circuit board; C. after electroplating the printed circuit board, punching the printed circuit board to make the diameter of the positioning holes be consistent with that of the film; and D. pressing screws into the positioning holes of the film, and then fitting the film onto the surface of the printed circuit board, wherein one end of each screw passes through each positioning hole of the printed circuit board, to complete contraposition joint between the printed circuit board and the film. The method is reasonable in design, and the contraposition is more accurate and faster.

Description

technical field [0001] The invention relates to alignment exposure of circuit and solder resist process in the production process of printed circuit board, in particular to a method for improving the alignment accuracy of printed circuit board and film. Background technique [0002] When the existing printed circuit board is exposed, the phenanthrene board is pasted on the surface of the printed circuit board and then exposed. Because the position between the phenanthrene board and the printed circuit board is sometimes inaccurate, the circuit after exposure is not as preset It is required to print on the surface of the printed circuit board to form a waste board, and it is slow and labor-intensive to paste the film on the surface of the printed circuit board. Contents of the invention [0003] Therefore, the object of the present invention is to provide a method for accurate alignment between a printed circuit board and a film with high alignment speed and high precision....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F9/00H05K3/00
Inventor 吴子坚
Owner 吴子坚
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