Wafer transport mechanism and usage method
A conveying mechanism and wafer technology, which is applied in the direction of conveyor objects, transportation and packaging, etc., can solve the problems of high equipment space requirements, heavy workload, complicated operation, etc., and achieve the effect of saving manpower, stable performance and simple operation
Active Publication Date: 2016-04-20
PIOTECH CO LTD
View PDF6 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
In short, during the whole process, the workload of the personnel is very large, the requirements for equipment space are high, the operation is more complicated, the whole process takes a long time, and there is inevitably a risk of burns
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment
[0014] refer to Figure 1-3 , the wafer conveying mechanism, a transfer paddle 1 is installed on a slide table, and a wafer storage tray 11 is placed at the front end of the transfer paddle 1, and the transfer paddle and the wafer storage tray are moved together by controlling the horizontal movement of the slide table to realize Automatic transfer of wafers.
[0015] The front end of the transfer paddle 1 is provided with a semicircular groove surface 8 whose size is similar to that of the outer edge of the wafer storage tray 11 . Two pin holes 18 are symmetrically arranged through the groove surface 8 according to the center, which are located on the same circumference and distributed at equal intervals. Two cylindrical pins 7 are seated in the pin holes 18 and protrude from the upper surface of the grooved face 8 . When in use, a detachable wafer storage tray 11 is placed in the semi-arc groove surface 8 at the front end of the transfer paddle 1 , and the two are fixedly ...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
A wafer conveying mechanism and an application method thereof are an improvement based on the prior art. An original manual operation process is replaced by automatic operation, manual operation is reduced, an automatic wafer conveying mechanism is added, and placing or taking of wafers and adjusting of the centers of the wafers are both achieved through automatic control. According to the wafer conveying mechanism, a conveying paddle is mounted on a sliding table, a wafer placing tray is placed at the front end of the conveying paddle, and automatic conveying of the wafers is achieved through control over horizontal moving of the sliding table. The application method comprises the steps that the detachable wafer placing tray is placed inside a semi-circle arc groove in the front end of the conveying paddle, and the detachable wafer placing tray and the semi-circle arc groove are fixedly connected through two cylindrical pins. According to the wafer conveying mechanism and the application method thereof, automatic taking and placing of the wafers inside a reacting chamber can be well achieved, operating is simple and fast, running is smooth, using performance is stable, manpower and material resources are saved, and the production cost of products is lowered.
Description
technical field [0001] The invention belongs to the technical field of semiconductor thin film deposition application and preparation, and relates to a wafer conveying mechanism and a use method that can well realize the automatic picking and placing of wafers in a reaction chamber. Background technique [0002] In the existing single-cavity semiconductor coating equipment, especially in the absence of a film transfer mechanism, manual film transfer has become inevitable. That is to say, the entire wafer transfer process needs to be manually operated from the opening of the cavity to the opening of the cavity and the removal of the wafer at the end of the process. Like this, all have very big limitation in terms of time and operation. When speaking, a certain amount of preparation time is required. Prepare the tools for taking wafers, such as suction cups or clips. Because the cavity temperature is very high to prevent burns, it is also necessary to prepare high temperatu...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/677
Inventor 凌复华王丽丹王燚国建花
Owner PIOTECH CO LTD