Ebullient cooling device

Abstract

A power card is accommodated in a vaporizing portion. Heat medium in the vaporizing portion is vaporized by heat generated at the power card so as to cool down the power card. A vapor passage and a condensing portion are connected to the vaporizing portion and a communication passage is provided at upper ends of the vapor passage and the condensing portion. The heat medium vaporized in the vaporizing portion moves up to the communication passage and to the condensing portion, so that the heat medium is condensed in the condensing portion and moves to the vaporizing portion. The condensing portion is arranged at an upstream side of the vapor passage in a direction of blowing air. A cross sectional area of the vapor passage is larger than that of the condensing portion.

Description

technical field [0001] The present disclosure relates to an ebullient cooling device that boils a heat medium by heat generated at an electronic component to be cooled (cooling object) to absorb heat from the cooling object and thereby cool the cooling object. Background technique [0002] Ebullient cooling devices such as disclosed in Japanese Patent No. 3487382 are known in the art. This ebullient cooling device has a heat medium portion for accommodating a heat medium therein, a cooling object (electronic device) attached to and in contact with an outer wall surface of the heat medium portion, and a heat radiation portion provided on The upper side of the heat medium part and communicates with the heat medium part to realize heat exchange between the heat medium rising from the surrounding air and the heat medium part, so that the heat medium is cooled and liquefied. [0003] According to the above ebullient cooling device, the vapor upward passage through which the heat...

AI Technical Summary

Problems solved by technology

As a result, the boiling cooling device in the prior art has a disadvantage in that the liquid-phase heat medium that is condensed by heat exchange with the air and moves in the downward direction can prevent the heat medium evaporated in the heat medium portion from moving in the upward direction

Then, sufficient circulation of the heat medium cannot be achieved and thus the necessary cooling performance of the ebullient cooling device cannot be obtained.

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