A kind of led radiator
A technology of LED heat sink and heat sink, which is applied in lighting and heating equipment, semiconductor devices of light-emitting elements, cooling/heating devices of lighting devices, etc., can solve the problems of reducing the service life of LED light sources and slow heat transfer speed, and achieve The effect of reducing the temperature difference and improving the heat transfer effect
Active Publication Date: 2016-07-06
爱博特电子(宁波)集团有限公司
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Problems solved by technology
However, the heat from the LED light source to the aluminum substrate to the heat transfer sheet and then to the heat sink, due to the slow heat transfer through aluminum or copper, there is a large temperature difference between the LED light source and the heat sink (usually up to ten degrees), As a result, the LED light source still works in a high temperature environment, which reduces the service life of the LED light source
Method used
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Embodiment
[0014] Embodiment: As shown in the figure, an LED heat sink includes a heat dissipation substrate 1 and a heat dissipation fin group 2. The heat dissipation fin group 2 includes a plurality of heat dissipation fins arranged at intervals on the top surface of the heat dissipation substrate 1, and the heat dissipation substrate 1 is provided with There is a cavity 3, and the cavity 3 is filled with cooling liquid. The evaporation temperature of the cooling liquid is 40-60 degrees. When the cooling liquid is heated to the evaporation temperature, the cooling liquid becomes gas and rises to the top of the cavity 3. The gas The heat is transferred to the top surface of the heat dissipation substrate 1, and the top surface of the heat dissipation substrate 1 transfers the heat to the heat sink. At this time, the temperature of the gas drops below the evaporation temperature and turns into a liquid and falls back to the bottom of the cavity 3, and it goes round and round. When working,...
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The invention discloses an LED (light-emitting diode) radiator, comprising a radiating substrate and a cooling fin group, wherein the cooling fin group comprises a plurality of cooling fins which are arranged at the top surface of the radiating substrate at intervals; a cavity is arranged inside the radiating substrate; cooling liquid is contained inside the cavity; the evaporation temperature of the cooling liquid is 40-60 DEG C; the cooling liquid becomes a gas to ascend to the top of the cavity when the heated temperature of the cooling liquid ascends to the evaporation temperature; the gas transfers energy to the top surface of the radiating substrate; the top surface of the radiating substrate transfers heat to the cooling fins; at the moment, the temperature of the gas is reduced to below the evaporation temperature, and the gas becomes liquid to fall to the bottom of the cavity in cycles. The LED radiator has the advantages that the heat is transferred through the cooling liquid inside the radiating substrate in cycle, so that the heat is more rapidly transferred to the cooling fins from an LED light source; the heat transfer effect of the radiator is improved; the difference in temperature between the LED light source and the radiator is reduced.
Description
technical field [0001] The invention relates to a radiator, in particular to an LED radiator. Background technique [0002] Existing LED lamps generally include an LED light source, a heat transfer sheet and a radiator. The LED light source includes an aluminum substrate and an LED light-emitting circuit arranged on the front of the aluminum substrate. The heat transfer sheet is fixedly arranged on the aluminum substrate. The bottom surface of the heat transfer sheet Bonded to the back of the aluminum substrate, the radiator includes a heat dissipation substrate and a heat dissipation fin group, the bottom surface of the heat dissipation substrate is bonded to the top surface of the heat transfer fin, and the heat dissipation fin group is composed of a plurality of heat dissipation fins arranged at intervals on the heat dissipation substrate. When the LED light source emits light, the heat generated by the LED is transferred to the heat transfer sheet through the aluminum su...
Claims
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IPC IPC(8): F21V29/51F21V29/74F21V29/83F21V29/89F21Y115/10F21V29/56
Inventor 陈云芽
Owner 爱博特电子(宁波)集团有限公司