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Rolled Copper Foil

A technology of rolling copper foil and copper foil, which is applied in the field of rolling copper foil, can solve the problems of reduced yield and reduced circuit etching, and achieve the effects of excellent bendability, improved operability, and good etching characteristics

Active Publication Date: 2016-01-06
JX NIPPON MINING & METALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This depression causes the etchability of the circuit to decrease, or is judged to be defective in the visual inspection, resulting in a decrease in yield.

Method used

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  • Rolled Copper Foil

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0088] The copper or copper alloy with the composition shown in Table 1 is used as a raw material to cast ingots, and hot rolled at above 800°C until the thickness reaches 10mm. Finishing during rolling to a thickness of 0.009-0.018mm. The rolling processing degree in the final cold rolling is 95 to 99.8%. In addition, in Table 1, tough copper is described as TPC, and oxygen-free copper is described as OFC. Oxygen-free copper is oxygen-free copper specified in JIS-H0500 (C1011), and ductile copper is tough copper specified in JIS-H0500 (C1100).

[0089] The final cold rolling was performed in 10 to 15 passes, and as shown in Table 1, the rolling was performed while changing the surface roughness of the rolls up to the final pass and the surface roughness of the rolls in the final pass. The surface roughness of the rolls from the first pass of final rolling to before the final pass was completely the same.

[0090] In addition, as "Reference Examples 6-9", according to the m...

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Abstract

[Problem] To provide a rolled copper foil whose surface is moderately rough to improve handleability and has excellent bendability, which hardly causes scratches on the surface during handling of the copper foil and has good surface etching characteristics. [Solution] Rolled copper foil whose surface roughness Ra and the ratio Ra / t to the thickness t of the copper foil is 0.004 or more and 0.007 or less, using a focused ion beam to produce a length of 25 μm in the direction parallel to the rolling of the copper foil When observing the scanning ion microscope image of the section, the average value Lsa of the depth Ls of the shear band in the thickness direction of the copper foil satisfies 0.01≦Lsa / t≦0.4 with respect to the thickness t of the copper foil relation.

Description

technical field [0001] The present invention relates to a rolled copper foil suitable for use in FPCs requiring flexibility. Background technique [0002] Copper foil used for bending FPC (flexible printed circuit board) requires high bendability. As a method for imparting flexibility to copper foil, a technique of increasing the degree of orientation of the crystal orientation of the (200) plane of copper foil (Patent Document 1) and increasing the ratio of crystal grains penetrating in the thickness direction of copper foil are known. technology (Patent Document 2), and a technology to reduce the surface roughness Ry (maximum height) corresponding to the depth of the oil pit of the copper foil to 2.0 μm or less (Patent Document 3). [0003] The usual FPC manufacturing steps are as follows. First, the copper foil and the resin film are bonded. For joining, there is a method of imidizing the varnish coated on the copper foil by heat treatment, and a method of laminating a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B21B3/00B21B1/40C22C9/00C22F1/00C22F1/08
CPCB21B3/003C22C9/00C22C9/02C22F1/08B21B1/40B21B3/00
Inventor 中室嘉一郎千叶喜宽大久保光浩鲛岛大辅
Owner JX NIPPON MINING & METALS CORP
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