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Detection method and device for through hole

A detection method and detection device technology, applied in the direction of measuring devices, optical devices, instruments, etc., can solve the problems of product damage, product scrapping, loss, etc., and achieve the effect of saving economic costs

Inactive Publication Date: 2013-12-25
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] From the above content, it can be seen that the existing via detection technology cannot detect the via in real time, and can only be detected after the processing of the via is completed. More importantly, the existing via detection technology is a destructive detection technology, it is necessary to cut and sample the product with vias before testing, thus destroying the product to be tested, making the product completely scrapped, and causing unnecessary losses

Method used

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  • Detection method and device for through hole
  • Detection method and device for through hole
  • Detection method and device for through hole

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 2

[0073] Image 6 Provide a kind of flow chart of the detection method of via for the present invention, as Image 6 As shown, wherein the via hole is set in the film layer, the detection method includes:

[0074] Step 201: Obtain the coordinate position of the via hole.

[0075] Step 202: Send incident light to the inner wall of the via hole.

[0076] Step 203: Receive the first reflected light reflected by the inner wall and the second reflected light formed by the lower bottom surface of the film layer.

[0077] Step 204: Generate an interference pattern according to the first reflected light and the second reflected light.

[0078] Step 205: Determine whether the interference pattern includes curved interference fringes.

[0079] If it is determined that the interference pattern does not include curved interference fringes, execute step 205; if it is determined that the interference pattern includes curved interference fringes, execute step 206.

[0080] Step 206: It is...

Embodiment 3

[0092] Figure 10 A flow chart of a via detection method provided in Embodiment 3 of the present invention, such as Figure 10 As shown, wherein the via hole is set in the film layer, the detection method includes:

[0093] Step 301: Adjust the position of the light source that emits the incident light so that the horizontal width of the incident light emitted onto the inner wall is a set width L.

[0094] Figure 11 The horizontal width of the incident light emitted to the inner wall is a schematic diagram of the set width L, such as Figure 11 As shown, since the light source providing the incident light is a surface light source, a certain area on the inner wall 1 can be irradiated by the incident light, and the corresponding width of this area in the horizontal direction is L.

[0095] There are many ways to realize that the horizontal width of the incident light emitted onto the inner wall is the set width L. Optionally, step 301 includes:

[0096] Step 3011: Perform ...

Embodiment 4

[0117] Figure 12 A schematic diagram for detecting by using the detection device of the via hole provided in the fourth embodiment of the present invention, such as Figure 12 As shown, the detection device includes: a transmitting device 5 , a receiving device 6 , a generating device 7 and a detection sub-device 8 .

[0118] Wherein, the emitting device 5 is used to emit incident light to the inner wall 1 of the via hole; the receiving device 6 is used to receive the first reflected light formed by the reflection of the inner wall 1 and the second reflected light formed by the reflection of the film layer 2; The interference pattern is generated according to the first reflected light and the second reflected light; the detection sub-device 8 is used to detect the inner wall parameters of the via hole according to the interference pattern.

[0119] The detection device for vias provided in Embodiment 4 of the present invention can be realized by using the detection method pr...

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Abstract

The invention discloses a detection method and device for a through hole, and the through hole is formed in a film layer. The detection method includes the steps that incident light is emitted to the inner wall of the through hole; first reflected light reflected by the inner wall and second reflected light reflected by the lower bottom surface of the film layer are received; an interference pattern is formed according to the first reflected light and the second reflected light; and parameters of the inner wall of the through hole are detected according to the interference pattern. The detection method achieves real-time detection on the through hole based on the light interference principle, and more importantly, the detection method does not need to destroy a product to be detected and therefore effectively saves economic cost.

Description

technical field [0001] The invention relates to the field of display panel processing, in particular to a detection method and a detection device for via holes. Background technique [0002] At present, when processing the display panel, in order to facilitate the connection between components, some via holes will be formed in the film layer on the display panel, and the wires will connect the components through the via holes. Among them, the film layer will include several sub-films Floor. [0003] In the process of etching the via hole, the junction of adjacent sub-film layers is prone to over-etching, and then there will be a problem of chamfering (undercut) on the inner wall of the via hole. Therefore, in the via hole After the processing is completed, the inner wall of the via hole needs to be inspected. Wherein, the detection of the via hole includes the detection of the flatness of the inner wall of the via hole and the detection of the inclination angle of the inne...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B11/00G01B11/26G01B11/30
Inventor 王守坤郭会斌刘晓伟郭总杰
Owner BOE TECH GRP CO LTD