Mold for upper cover of junction box
A junction box and mold technology, used in the field of junction box cover molds, can solve problems such as increasingly higher requirements, inability to meet the requirements of product replacement and quality improvement, and achieve the effect of ensuring fixation, increasing size, and improving quality
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[0015] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.
[0016] Refer below figure 1 A mold 1 according to an embodiment of the present invention is described. Such as figure 1 As shown, the mold 1 according to the embodiment of the present invention includes a top plate, an upper insulating plate, an upper mold plate, a lower mold plate, a lower insulating plate, a bottom plate and a die groove 10 .
[0017] The upper heat insulation board is arranged on the lower surface of the top plate, and the upper mold plate is arranged on the lower surface of the upper heat insulation board. The low...
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