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Mold for upper cover of junction box

A junction box and mold technology, used in the field of junction box cover molds, can solve problems such as increasingly higher requirements, inability to meet the requirements of product replacement and quality improvement, and achieve the effect of ensuring fixation, increasing size, and improving quality

Inactive Publication Date: 2014-01-08
昆山金九亿精密金属有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002]Injection mold is an important process equipment for producing various industrial products. With the rapid development of plastic mold design industry and plastic products in aviation, aerospace, electronics, machinery, With the promotion and application of industrial sectors such as ships and automobiles, the product has higher and higher requirements for molds. The traditional plastic mold design method can no longer meet the requirements of product upgrading and quality improvement.

Method used

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  • Mold for upper cover of junction box

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Embodiment Construction

[0015] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0016] Refer below figure 1 A mold 1 according to an embodiment of the present invention is described. Such as figure 1 As shown, the mold 1 according to the embodiment of the present invention includes a top plate, an upper insulating plate, an upper mold plate, a lower mold plate, a lower insulating plate, a bottom plate and a die groove 10 .

[0017] The upper heat insulation board is arranged on the lower surface of the top plate, and the upper mold plate is arranged on the lower surface of the upper heat insulation board. The low...

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Abstract

The invention provides a mold for an upper cover of a junction box. The mold comprises a top plate, an upper heat insulation plate, an upper mold plate, a lower mold plate, a lower heat insulation plate, a bottom plate and a mold pressing slot, wherein the upper heat insulation plate is arranged on the lower surface of the top plate; the upper mold plate is arranged on the lower surface of the upper heat insulation plate; the lower mold plate is arranged on the lower surface of the upper mold plate, and a mold cavity is defined between the upper mold plate and the lower mold plate; the lower heat insulation plate is arranged on the lower surface of the lower mold plate; the bottom plate is arranged on the lower surface of the lower heat insulation plate; the mold pressing slot is formed between the upper mold plate and the lower mold plate and endowed with a gradient. According to the mold provided by the invention, an original mold pressing slot is endowed with a gradient, so that the size of a mold pressing surface is increased, and more than two plates can be pressed; the firm fixation of the mold on a machine table is ensured, the dislocation and the damages of the mold, which are caused by poor fixation, can be avoided, and the product quality is further improved.

Description

technical field [0001] The invention relates to a mold for an upper cover of a junction box. Background technique [0002] Injection mold is an important process equipment for the production of various industrial products. With the rapid development of plastic mold design industry and the promotion and application of plastic products in aviation, aerospace, electronics, machinery, ships and automobiles and other industrial sectors, the requirements of products for molds Higher and higher, the traditional plastic mold design method can no longer meet the requirements of product upgrading and quality improvement. Computer-aided engineering technology has become the most effective way for these weak links in plastic product development, mold design and product processing. Contents of the invention [0003] The invention provides a mold for the upper cover of a junction box. The mold includes: a top plate; an upper heat insulation plate, which is arranged on the lower surface...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C45/26
CPCB29C45/2602
Inventor 许志君
Owner 昆山金九亿精密金属有限公司
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