Handling method adopted after cutting wire breakage of multi-wire sawing machine

Abstract

The invention discloses a handling method adopted after cutting wire breakage of a multi-wire sawing machine. For improving the repair success rate of damaged silicon crystal bars on the multi-wire sawing machine, the handling method adopted after the cutting wire breakage of the multi-wire sawing machine comprises the following steps of 1 shearing incompact cutting wires at the wire breakage position and enabling a distance between two wire ends of each cutting wire to be 10cm larger than each slot distance of main roller wire slots; 2 polishing two wire ends and enabling the diameter of the wire ends of each polished cutting wire to be 1 / 3-1 / 2 of the diameter of each non-broken cutting wire, wherein the polishing length of each wire end is at least 5cm; 3 overlapping and welding the polished cutting wire ends; 4 winding the incompact sections of the cutting wires on a main roller and starting the main roller to enable the cutting wire to be in a tensioning state; 5 turning the main roller to drive the cutting wire sections at the breakage welding position to the indirect cutting stress position. Silicon crystal bars are not required to be taken from a workpiece clamp, an original cutting point is easy to find and reset, errors are decreased during cutter resetting, and the repair success rate of the damaged silicon crystal bars can be improved.

Description

technical field [0001] The invention relates to a processing method for broken wires of a multi-wire cutting machine. Background technique [0002] At present, in the process of cutting crystal ingots into pieces, when the cutting machine has a problem of high-level broken wires, it is generally used to cut back or lift and press down to cut. The above two methods will cause relatively large damage to the silicon wafers, and in severe cases may cause the crystal ingots to be damaged. scrapped. Contents of the invention [0003] In order to improve the success rate of saving rods of multi-wire cutting machines, the present invention aims to provide a treatment method after cutting wires of multi-wire cutting machines are broken. The origin return is easy to find, and the error is reduced when resetting the knife, which can improve the success rate of saving the stick. [0004] In order to achieve the above object, the technical solution adopted in the present invention is...

AI Technical Summary

Problems solved by technology

[0002] At present, in the process of cutting crystal ingots into pieces, when the cutting machine has a problem of high-level broken wires, it is generally used to cut back or lift and press down to cut. The above two methods will cause relatively large damage to the silicon wafers, and in severe cases may cause the crystal ingots to be damaged. scrapped

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