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8 results about "Multi-wire saw" patented technology

A multi-wire saw is a cutting machine designed to slice hard materials. This device is especially important in the solar cell industry. Over 80% of the world's solar cell production requires the cutting of silicon ingots into wafers. As a result, multi-wire sawing is an important process in the photovoltaic and microelectronics industries.

Stroke control device of multi-wire saw and control method thereof

PCT designated stageWO2026146718A1Wire rodReciprocating motion
The present invention provides a stroke control device of a multi-wire saw, the device comprising: a spool having a cylindrical shape, having flanges at both ends, which protrude from the outer circumferential surface thereof in the circumferential direction, having a starting point of a wire unwinding point formed adjacent to the inner surface of any one of the flanges, and having a wire wound thereon through rotation; a pulley which guides a wire delivered from a cutting area, to the unwinding point; a traverse which linearly reciprocates a traverse arm having the pulley installed thereon, along the axial direction of the spool to correspond to a stroke by which the wire is wound on the spool; a lidar sensor which detects a position of each flange or a distance between the flanges; and a control unit which controls the traverse such that the wire delivered from the pulley at the unwinding point formed on the outer circumferential surface of the spool maintains a direction orthogonal to the axial direction.
Owner:HANWHA SOLUTIONS CORP

Working fluid

To provide a working fluid which can be used in a multi-wire saw device, has proper cutting performance, and is excellent in cleanliness.SOLUTION: A working fluid comprising an active ingredient and water, wherein the active ingredient comprises the following components (A) and (B), and the content of the component (B) is 25.0% by mass or less based on the total amount of the active ingredient: ・Component (A): One or more selected from alkylene glycol and epichlorohydrin-unmodified polyoxyalkylene compound Component (B): Epichlorohydrin-modified polyoxyalkylene compound SELECTED DRAWING: None
Owner:IDEMITSU KOSAN CO LTD

Processing liquid

Provided is a processing liquid which can be used in a multi-wire saw device, has suitable cutting performance, and exhibits excellent cleaning properties. Specifically, provided is a processing liquid that contains an active component and water, wherein the active component contains component (A) and component (B), and the content of component (B) is 25.0 mass% or less based on the total amount of the active component. Component (A): one or more types selected from among alkylene glycols and epichlorohydrin-modified polyoxyalkylene compounds. Component (B): an epichlorohydrin-modified polyoxyalkylene compound.
Owner:IDEMITSU KOSAN CO LTD

Cutting device and multi-fretsaw equipment

The invention relates to the technical field of multi-wire saw equipment, in particular to a cutting device and multi-wire saw equipment, the cutting device comprises a driving wheel, a driven wheel set, a cutting line and a tension adjusting structure, the cutting line is wound among the driving wheel, the driven wheel set and the tension adjusting structure, and the tension adjusting structure is located between the driving wheel and the driven wheel set. The tensioning adjusting structure comprises a tensioning piece, a guide wheel connected with the tensioning piece, a sensor and a hinge point, the tensioning adjusting structure is hinged and fixed through the hinge point, the cutting line is wound on the guide wheel, the sensor is used for detecting the stress state of the cutting line, and the tensioning piece feeds back and adjusts the position of the guide wheel according to the stress state of the sensor. Therefore, the tension force of the cutting line is adjusted. The multiple cutting lines and the multiple tensioning adjusting structures are arranged, and the cutting lines and the tensioning adjusting structures are arranged in a one-to-one correspondence mode. The technical problems that due to the fact that the stability of tension of an existing cutting line is poor, the slicing quality of multi-wire saw equipment is poor, and the line breaking rate of the cutting line is high are solved.
Owner:SHIJIN (XIAN) APPLIED MATERIALS CO LTD +1

SiC crystal, SiC crystal bar, and method for producing SiC crystal

The purpose of the present invention is to provide a SiC crystal, a SiC crystal bar, and a method for producing a SiC crystal, wherein defects do not easily occur when a bonded body obtained by bonding crystals is cut using a multi-wire saw. A SiC crystal according to an embodiment of the present invention has a first surface that is one surface in a lamination direction, and when a waviness curve of the first surface is measured along a first measurement line that passes through the center of the first surface and extends in a < 1-100 > direction, the lowest point of the waviness curve in the first measurement line is located at a position offset from the center.
Owner:RESONAC CORP

Working fluid

To provide a working fluid which can be used in a multi-wire saw device and is excellent in performance for preventing the deflection of a wire saw.SOLUTION: A working fluid comprising an active ingredient and water, wherein the active ingredient comprises the following component (A): ・Polyoxyalkylene amine having a base number of 5.0 to 110mgKOH / g and a nitrogen content of 0.10 to 3.0% by mass SELECTED DRAWING: None
Owner:IDEMITSU KOSAN CO LTD

Working fluid

The present invention provides a working fluid which can be used in a multiwire saw device and which is excellent in preventing wire saw deflection. The working fluid contains an active ingredient and water, wherein the active ingredient contains the following component (A). ・Component (A): a polyoxyalkylene amine having a base number of 5.0-110 mgKOH / g and a nitrogen atom content of 0.10-3.0 mass%
Owner:IDEMITSU KOSAN CO LTD

SiC crystal, SiC boolean, and method for manufacturing SiC crystal

The objective is to provide SiC crystals, SiC boules, and methods for manufacturing the same, which are less prone to defects when cutting a bonded structure of joined crystals with a multi-wire saw. [Solution] The SiC crystal according to this embodiment has a first surface which is one surface in the stacking direction, and when the waviness curve of the first surface is measured along a first measurement line which passes through the center of the first surface and extends in the <1-100> direction, the lowest point of the waviness curve on the first measurement line is located at a position offset from the center.
Owner:RESONAC CORP