Multi-wire sawing machine for silicon wafers

Abstract

The invention relates to a multi-wire sawing machine for silicon wafers. The multi-wire sawing machine comprises a rack, a guide wheel assembly fixed to the rack, a crystal supporting assembly, a wire net and a vibration damper, wherein the guide wheel assembly comprises a plurality of sets of guide wheels which are arranged in pairs; the crystal supporting assembly is located on the outer side of the part between at least one pair of guiding wheels; the net wire surrounds the multiple sets of guiding wheels which are arranged in pairs; the vibration damper is located between the guiding wheels and comprises a roller structure and a supporting structure used for supporting the roller structure, the roller structure is connected with the wire net in an abutted manner, and the supporting structure is fixedly connected with the rack; and the crystal supporting assembly and the vibration damper are installed on the two sides of the wire net. According to the multi-wire sawing machine for the silicon wafers, on one hand, the fulcrum distance of the wire net is shortened, the amplitude of the wire net is reduced, and therefore the probability that the wire net jumps out of a guide wheel groove is reduced, and the wire breaking problem caused by wire jumping is solved; and on the other hand, the wire arch of the wire net is correspondingly reduced, the sawing efficiency of the wire net can be improved, and therefore the production efficiency is improved, the probability of edge breaking caused when the silicon wafers go out of a cutter edge is reduced, and the yield of products is improved.

Description

technical field [0001] The invention relates to the field of silicon wafer processing, in particular to a silicon wafer multi-wire cutting machine. Background technique [0002] At present, in the silicon wafer cutting process in the solar energy field, solar-grade battery silicon wafers are cut from silicon blocks or silicon rods by multi-wire cutting machines. According to the current industry development trend, diamond wire multi-wire cutting technology will become the future multi-wire cutting technology. Mainstream cutting. However, the traditional free-state silicon wafer multi-wire cutting machine 100' has a large loading capacity and a wide wheelbase, such as figure 1 shown. When directly using diamond wire cutting on such equipment, if the diamond wire is cut at high speed, the vibration frequency and amplitude of the steel wire will be large, which will easily cause the diamond wire to jump out of the guide wheel groove, causing the diamond wire to rub against ea...

AI Technical Summary

Problems solved by technology

[0003] Based on this, it is necessary to provide a silicon wafer multi-wire cutting machine that is conducive to the application of diamond wire in view of the problem that the traditional wide wheelbase multi-wire cutting machine for silicon wafers is not conducive to the application of diamond wire.

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