Diamond wire cutting method

A diamond wire cutting and diamond wire technology, which is applied to fine working devices, stone processing equipment, manufacturing tools, etc., can solve the problems of large wire bow of diamond wire and affect the cutting ability of diamond wire, so as to reduce the wire bow and reduce Wire consumption and disconnection risk, good quality effect

Active Publication Date: 2019-04-16
GCL POLY ENERGY HLDG
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  • Abstract
  • Description
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Problems solved by technology

[0005] Based on this, it is necessary to provide a diamond wire cutting method for the problem that as the speed of the diamond

Method used

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  • Diamond wire cutting method
  • Diamond wire cutting method
  • Diamond wire cutting method

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Embodiment Construction

[0025] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0026] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to t...

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Abstract

The invention relates to a diamond wire cutting method. The method includes a cutter feeding stage, a vibrating cutting stage and a cutter discharging stage, and a multi-wire sawing machine is used for cutting silicon bars, silicon blocks and the like. In the vibrating cutting stage, the workpiece feeding speed and the diamond wire speed are both periodically changed, the workpiece feeding speed is changed along with changing of the diamond wire speed, when a diamond wire moves at a constant speed, a workpiece also moves at a constant speed, when the diamond wire moves in a deceleration mode,the workpiece also moves in a deceleration mode, and when the diamond wire moves in an accelerating mode, the workpiece also moves in an accelerating mode, so that difference value fluctuation betweenthe workpiece feeding speed and the diamond wire speed is reduced, and wire arching of the diamond wire is reduced so as to reduce wire consumption and a wire breaking risk of the diamond wire; meanwhile, cutting capacity of the diamond wire is guaranteed, obvious cutting marks on the surfaces of silicon wafers are reduced, and silicon wafers with the better quality are obtained.

Description

technical field [0001] The invention relates to the technical field of multi-wire cutting of silicon wafers, in particular to a diamond wire cutting method. Background technique [0002] Silicon wafers for solar cells are cut from silicon blocks or rods by a multi-wire cutting machine. With the development trend of the silicon wafer industry, diamond wire multi-wire cutting technology has become the mainstream technology of multi-wire cutting. Diamond wire multi-wire cutting technology has the advantages of high cutting efficiency, small silicon wafer damage layer, and small silicon wafer TTV (Total Thickness Variation, total thickness deviation). [0003] In the traditional diamond wire multi-wire cutting process, the cutting is mainly completed by the reciprocating motion of the diamond wire. Usually, the movement of the diamond wire decelerates and stops first during the reversing process, and then accelerates to the cutting speed. [0004] In the process of realizing t...

Claims

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Application Information

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IPC IPC(8): B28D5/04
CPCB28D5/04
Inventor 张强
Owner GCL POLY ENERGY HLDG
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