Diamond wire cutting method

Abstract

The invention relates to a diamond wire cutting method. The method includes a cutter feeding stage, a vibrating cutting stage and a cutter discharging stage, and a multi-wire sawing machine is used for cutting silicon bars, silicon blocks and the like. In the vibrating cutting stage, the workpiece feeding speed and the diamond wire speed are both periodically changed, the workpiece feeding speed is changed along with changing of the diamond wire speed, when a diamond wire moves at a constant speed, a workpiece also moves at a constant speed, when the diamond wire moves in a deceleration mode,the workpiece also moves in a deceleration mode, and when the diamond wire moves in an accelerating mode, the workpiece also moves in an accelerating mode, so that difference value fluctuation betweenthe workpiece feeding speed and the diamond wire speed is reduced, and wire arching of the diamond wire is reduced so as to reduce wire consumption and a wire breaking risk of the diamond wire; meanwhile, cutting capacity of the diamond wire is guaranteed, obvious cutting marks on the surfaces of silicon wafers are reduced, and silicon wafers with the better quality are obtained.

Description

technical field [0001] The invention relates to the technical field of multi-wire cutting of silicon wafers, in particular to a diamond wire cutting method. Background technique [0002] Silicon wafers for solar cells are cut from silicon blocks or rods by a multi-wire cutting machine. With the development trend of the silicon wafer industry, diamond wire multi-wire cutting technology has become the mainstream technology of multi-wire cutting. Diamond wire multi-wire cutting technology has the advantages of high cutting efficiency, small silicon wafer damage layer, and small silicon wafer TTV (Total Thickness Variation, total thickness deviation). [0003] In the traditional diamond wire multi-wire cutting process, the cutting is mainly completed by the reciprocating motion of the diamond wire. Usually, the movement of the diamond wire decelerates and stops first during the reversing process, and then accelerates to the cutting speed. [0004] In the process of realizing t...

AI Technical Summary

Problems solved by technology

[0005] Based on this, it is necessary to provide a diamond wire cutting method for the problem that as the speed of the diamond wire changes, the wire bow of the diamond wire becomes larger and larger, which affects the cutting ability of the diamond wire

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