Online monitoring device and method for wire bow of wire mesh of multi-wire sawing machine

A multi-wire cutting machine and monitoring device technology, which is applied to fine working devices, working accessories, stone processing equipment, etc., can solve the problems of scrapping of slicing quality ingots, difficult to monitor the influence of wire bows in real time, etc., to prevent wire breakage, Guaranteed cutting quality

Inactive Publication Date: 2017-01-11
TIANJIN UNIV OF TECH & EDUCATION TEACHER DEV CENT OF CHINA VOCATIONAL TRAINING & GUIDANCE +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention provides an online monitoring device and method for a multi-wire cutting machine wire network and wire bow, aiming at the problem that the wire bow is difficult to monitor in real time due to the harsh environment in the cutting area, which affects the slice quality and even the crystal ingot is scrapped due to wire breakage during the multi-wire cutting process.

Method used

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  • Online monitoring device and method for wire bow of wire mesh of multi-wire sawing machine
  • Online monitoring device and method for wire bow of wire mesh of multi-wire sawing machine
  • Online monitoring device and method for wire bow of wire mesh of multi-wire sawing machine

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Embodiment Construction

[0028] The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments. In particular, the following examples are only used to illustrate the present application, but not to limit the scope of the present application. This embodiment is a part of the embodiments of the present application, but not all of the embodiments. All other embodiments obtained by persons of ordinary skill in the art without creative efforts belong to the scope of protection of the present application. figure 1 It is a sectional view of the inventive device, figure 2 Invention device structure diagram, image 3 Schematic diagram of wire bow monitoring for the invention device.

[0029] An on-line monitoring device for a wire, net and wire bow of a multi-wire cutting machine, comprising a distance sensor 19; the distance sensor 19 is fixed inside the casing 9 through a lock nut 20; the casing 9 is connected to a protective gas inlet pipe 22; the di...

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Abstract

The invention discloses an online monitoring device and method for a wire bow of a wire mesh of a multi-wire sawing machine. The wire bow is an important factor influencing the quality of slices of the multi-wire sawing machine, but cutting areas are severe in environment and lack effective means for conducting online monitoring on the wire bow. The monitoring device and method involve a distance sensor, a shell, a protection gas inlet pipe, a support and a wire bow display module, the distance by which the mortar plane on the wire mesh deviates from the balance position during processing can be monitored online, and therefore the angle of the wire bow of the wire mesh is calculated. By means of the online monitoring device and method, online monitoring of the wire bow in the sawing process is achieved, and important application value for improving the slice quality and evaporating adjustment process parameters is achieved.

Description

technical field [0001] The invention relates to an online monitoring device and method for a wire, net, and wire bow of a multi-wire cutting machine, which is used for realizing online monitoring of a wire, net, and wire bow in a multi-wire cutting process, and belongs to the field of semiconductor hard and brittle material slicing processing. Background technique [0002] Crystalline materials, such as but not limited to monocrystalline silicon, polycrystalline silicon, sapphire, etc., are important substrate materials for integrated circuit chips, solar cells, and light-emitting diodes. They must be processed into thin sheets with high dimensional and shape accuracy. Because of the high hardness and brittleness of crystal materials, it is difficult to slice them. At present, most of the slicing processing of substrates is processed by multi-wire cutting machines. Multi-wire cutting machine is a new type of high-efficiency and high-precision cutting equipment, referred to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D7/00B28D5/04
Inventor 黎振王敏杰蔡玉俊李敬财马前帅
Owner TIANJIN UNIV OF TECH & EDUCATION TEACHER DEV CENT OF CHINA VOCATIONAL TRAINING & GUIDANCE
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