Ultrasonic free grinding material multi-wire saw cutting method and special purpose device

An ultrasonic and sawing technology, which is applied in the direction of stone processing equipment, stone processing tools, fine working devices, etc., can solve the problems of edge chipping, low cutting precision, and low cutting efficiency of the silk surface, so as to improve the accuracy, The effect of low cost and simple structure

Inactive Publication Date: 2013-05-15
赵钧永
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When using the existing multi-wire sawing method to cut hard and brittle materials, the cutting efficiency is usually low, the cutting ac...

Method used

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  • Ultrasonic free grinding material multi-wire saw cutting method and special purpose device
  • Ultrasonic free grinding material multi-wire saw cutting method and special purpose device
  • Ultrasonic free grinding material multi-wire saw cutting method and special purpose device

Examples

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Embodiment approach

[0071] Another embodiment of the ultrasonic multi-wire sawing method of the present invention comprises steps:

[0072] (1) setting a sawing wire mesh comprising at least one cutting side, and placing the object to be cut above the sawing wire mesh on the cutting side;

[0073] (2) Set a liquid tank that can accommodate free abrasive grinding fluid under the sawing wire mesh on the cutting side and the object to be cut, and inject the grinding fluid so that the cutting front and the part of the sawing wire mesh close to the cutting front during cutting submerged in grinding fluid;

[0074] (3) setting at least one ultrasonic generating device comprising at least one ultrasonic emitting surface in contact with at least part of the cutting side sawing wire, the ultrasonic emitting surface is the surface of a round rod or a round tube, from the upper surface of the sawing wire mesh Contact the sawing wire downward or downward, wherein the contact point or surface can be arranged...

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Abstract

The invention relates to an ultrasonic free grinding material multi-wire saw cutting method and a special purpose device. When an existing grinding material multi-wire saw cutting method is adopted to cut crisp and hard materials, generally cutting efficiency is low and cutting precision is not high. By the adoption of the novel ultrasonic free grinding material multi-wire saw cutting method and the special purpose device, ultrasonic energy is skillfully used for cutting and sawing in auxiliary mode so as to enable ultrasonic waves to be transmitted in a direct contact mode and generate action at the front edge of cutting, the technical limitation that prior ultrasonic saw cutting only can be used for mono-wire saw cutting of solidified grinding materials and consumption of friction is large is overcome, the method and the device is suitable for multi-wire saw cutting of various materials of the crisp and hard materials, cutting speed can be largely increased, roughness if a saw cutting face is lowered, cutting loss is lowered, saw cutting precision is raised, and the rate of finished products is improved.

Description

technical field [0001] The invention relates to a method for ultrasonic free abrasive multi-wire sawing of solid materials (also known as free abrasive multi-wire sawing) and special equipment for implementing the method. Background technique [0002] Existing methods of free abrasive multi-wire sawing dedicated to solid materials, such as but not limited to hard and brittle crystal materials including silicon, alumina, etc., usually include the steps of: using 2 or more sawing wires arranged in a wiring system A sawing wire mesh comprising at least 2 sawing wires, so that while the sawing wires are making a cutting movement, the object to be cut is brought into contact with the sawing wire mesh on the cutting side, through free abrasives such as abrasive mortar carried by the sawing wires during their movement The grinding and cutting effect of the machine realizes the cutting of the object to be cut, including the sectioning or slicing of the crystal ingot, etc. Wherein, ...

Claims

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Application Information

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IPC IPC(8): B28D5/00B28D1/02
Inventor 赵钧永
Owner 赵钧永
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