Microwave dielectric ceramic Ba6W2V2O17 capable of being sintered at low temperature and preparation method thereof

Abstract

The invention discloses microwave dielectric ceramic Ba6W2V2O17 capable of being sintered at a low temperature and a preparation method thereof. The microwave dielectric ceramic capable of being sintered at the low temperature has the composition of Ba6W2V2O17. The preparation method comprises the following steps: (1) weighing and batching original powder of BaCO3, WO3 and V2O5 with the purity of over 99.9 percent according to the chemical formula of the Ba6W2V2O17; (2) mixing the raw materials of the step (1) and performing wet milling for 12 hours, wherein the solvent is distilled water; pre-sintering for 6 hours in air atmosphere at 830 DEG C after the mixture is dried; (3) adding an adhesive into the prepared powder, granulating, pressing, forming, and sintering for 4 hours in the air atmosphere at 920 DEG C, wherein the adhesive adopts a polyvinyl alcohol solution with the mass concentration of 5 percent, and the dosage of the polyvinyl alcohol solution accounts for 3 percent of the total mass of the powder. The ceramic prepared by the invention is sintered well between 890 and 920 DEG C, has the dielectric constant between 25 and 26, the Qf (quality factor) value between 88,000 and 94,000 GHz, and low temperature coefficient of resonance frequency, can be co-fired with an Ag electrode, and has a great application value in industry.

Description

technical field [0001] The invention relates to a dielectric ceramic material, in particular to a microwave dielectric ceramic material for microwave components used at microwave frequencies, such as a dielectric substrate, a resonator, and a filter, and a preparation method thereof. Background technique [0002] Microwave dielectric ceramics refer to ceramics that are used as dielectric materials in circuits in the microwave frequency band (mainly UHF and SHF bands) and perform one or more functions. They are widely used as resonators, filters, and dielectric substrates in modern communications. Components such as chips and dielectric waveguide circuits are the key basic materials of modern communication technology. They have been used in portable mobile phones, car phones, cordless phones, TV satellite receivers and military radars. They are used in modern communication tools. It is playing an increasingly important role in the process of miniaturization and integration. ...

AI Technical Summary

Problems solved by technology

In recent years, with the development of low temperature co-fired ceramics (Low Temperature Co-fired Ceramics, LTCC) and the requirements of the development of microwave multilayer devices, researchers at home and abroad have carried out extensive exploration and research on some

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