A kind of anti-ultraviolet heat dissipation coating for LED lamp and preparation method thereof

Abstract

An anti ultraviolet heat radiation paint for an LED lamp is prepared by the following raw materials by weight: 30-34 parts of amino resin, 12-15 parts of acrylic resin, 5-7 parts of dipropylenetriamine, 8-10 parts of nanometer titanium dioxide, 4-5 parts of nanometer jade powder, 2-3 parts of hollow glass microballoon, 2-3 parts of zinc oxide, 10-12 parts of ethyl methyl ketone, 16-18 parts of acetic ester, 2-3 parts of silane coupling agent KH-550, 3-4 parts of promoter M, 2-3 parts of dicapryl phthalate, 14-16 parts of aluminium nitride powder, and 3-4 parts of film forming auxiliary agent. Nanometer titanium dioxide is added so as that the paint can effectively shield ultraviolet ray, can prolong service life, is difficult to age, and is beneficial to human body health; nanometer jade powder is added so as that the paint can make anti-bacterium and mildew-resistant effect; aluminium nitride powder is added so to accelerate heat conduction rate of the paint; and the paint has advantages of large adhesion stress, not easy shedding, aging resistance and long service life.

Description

technical field [0001] The invention belongs to the technical field of coatings, and relates to a heat-dissipating coating, in particular to a UV-resistant and heat-dissipating coating for LED lamps and a preparation method thereof. Background technique [0002] As LED technology has received widespread attention as a new generation of lighting technology in recent years, the power of LED has increased, and the heat dissipation problem has also attracted more and more attention. At present, most of the thermal conductive adhesives are used to solve the heat dissipation problem of LED lamps, but the materials used have technical problems such as poor temperature resistance and aging resistance, low adhesion to the substrate, poor heat dissipation effect and inconvenient operation, which are difficult to meet people's expectations. Requirements for heat dissipation of LED lamps. Some manufacturers also start to select materials with higher thermal conductivity, but this will ...

AI Technical Summary

Problems solved by technology

At present, most of the thermal conductive adhesives are used to solve the heat dissipation problem of LED lamps, but the materials used have technical problems such as poor temperature resistance and aging resistance, low adhesion to the substrate, poor heat dissipation effect and inconvenient operation, which are difficult to meet people's expectations. Requirements for heat dissipation of LED lamps

Some manufacturers are also starting to choose materials with higher thermal conductivity, but this will increase the production cost of LEDs.