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Ceramic precursor modified phenolic adhesive and preparation method thereof

A technology of phenolic adhesives and ceramic precursors, applied in adhesives, aldehyde/ketone condensation polymer adhesives, adhesive types, etc., can solve the problem of low bonding strength, use temperature that cannot meet the performance requirements of new materials, The brittleness of phenolic formaldehyde and other problems can be improved to improve the heat resistance

Inactive Publication Date: 2014-11-19
INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention aims to solve the problems of high brittleness of ordinary phenolic formaldehyde, low bonding strength, and use temperature that cannot meet the performance requirements of new materials, and provides a ceramic precursor modified phenolic adhesive and its preparation method

Method used

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  • Ceramic precursor modified phenolic adhesive and preparation method thereof
  • Ceramic precursor modified phenolic adhesive and preparation method thereof
  • Ceramic precursor modified phenolic adhesive and preparation method thereof

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specific Embodiment approach 1

[0011] Specific implementation mode 1: In this implementation mode, a ceramic precursor modified phenolic adhesive is prepared from phenol, formaldehyde solution and polyaluminocarbosilane. According to the mass parts, the phenol is 80 to 100 parts, and the formaldehyde solution is 80 parts. ~100 parts and 1 part~15 parts of polyaluminocarbosilane, wherein the mass concentration of formaldehyde solution is ≥36%.

[0012] In this embodiment, polyaluminocarbosilane is used to modify the phenolic adhesive to improve the heat resistance of the phenolic adhesive, which can be used in a temperature environment of 600°C or even higher, and is suitable for bonding high temperature resistant alloys, composite materials and ceramic materials. For bonding and sealing, the pot life of the ceramic precursor modified phenolic adhesive prepared in this embodiment is 30 minutes to 60 minutes. After curing, the temperature is raised to 600°C at 10°C / min, and the thermal weight loss is ≤10%.

specific Embodiment approach 2

[0013] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the polyaluminocarbosilane is 10-14 parts by mass. Others are the same as in the first embodiment.

specific Embodiment approach 3

[0014] Embodiment 3: The method for preparing a ceramic precursor modified phenolic adhesive described in Embodiment 1 is specifically carried out according to the following steps:

[0015] 1. Weigh 80 to 100 parts of phenol, 80 to 100 parts of formaldehyde solution, 1 to 15 parts of polyaluminocarbosilane and 1 to 5 parts of basic catalyst according to the parts by mass, wherein the formaldehyde solution The mass concentration is ≥36%;

[0016] 2. Mix the phenol, formaldehyde solution, polyaluminocarbosilane and basic catalyst weighed in step 1, control the temperature at 90°C to 95°C, keep it for 6h under stirring conditions, then lower the temperature to room temperature, and then reduce Pressure distillation, when the pressure of the system is reduced to 120°C, stop the decompression, then add ethyl acetate to prepare a solution with a mass concentration of 70%, which is the ceramic precursor modified phenolic adhesive, and complete a Preparation method of ceramic precurs...

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Abstract

The invention discloses a ceramic precursor modified phenolic adhesive and a preparation method thereof, and relates to an adhesive and a preparation method thereof, aiming at solving the problems that the ordinary phenolics are high in fragility, low in adhesive strength, and incapable of meeting the performance requirement of a new material in use temperature. The ceramic precursor-modified phenolic adhesive is prepared by phenolics, formaldehyde solution and polyaluminocarbosilane; the method comprises the steps of I, weighing; and II, preparing. The phenolic adhesive is modified by utilizing polyaluminocarbosilane, so as to improve the heat resistance property of the phenolic adhesive, the modified phenolic adhesive can be used under the environment of 600 DEG C and even higher temperature, is suitable for adhesion and sealing of high temperature-resistant alloy, a composite material and a ceramic material. The method is used for preparing the ceramic precursor-modified phenolic adhesive.

Description

technical field [0001] The invention relates to an adhesive and a preparation method thereof. Background technique [0002] With the rapid development of aviation and aerospace, higher requirements are put forward for materials, which need to withstand harsh environments such as high speed, high temperature and corrosion. Because phenolic adhesive has excellent heat resistance and water resistance, and can be used for a long time at 250°C, it has been widely used in the bonding and sealing of heat-resistant parts of aircraft and the prepreg of composite materials. However, ordinary phenolic formaldehyde has high brittleness and low bonding strength, and its use temperature can no longer meet the performance requirements of new materials, which limits its further application. Contents of the invention [0003] The invention aims to solve the problems that ordinary phenolic formaldehyde has high brittleness, low bonding strength, and the use temperature cannot meet the perf...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J161/14C08G8/28
Inventor 曹先启王勃陈泽明梁西良李博弘王超周红霞
Owner INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI