Electronic device

Abstract

The invention provides an electronic device. The electronic device comprises a shell, a fan body and a pedestal. The fan body possesses an air outlet surface, an air inlet surface, a first side surface and a second side surface. The second side surface is provided with a reinforcement rib. The first side surface is provided with a first corresponding structure and the pedestal is arranged on the shell. The pedestal is provided with a second corresponding structure. When the first side surface possessing the first corresponding structure is installed correspondingly to the pedestal, the first corresponding structure and the second corresponding structure are jointed. The fan body can be placed at a first position in the pedestal so that an airflow passes through the air inlet surface and the air outlet surface and heat dissipation in the shell is performed. When the second side surface possessing the reinforcement rib is installed correspondingly to the pedestal, the second corresponding structure stops the reinforcement rib from entering into so that the fan body stays at a second position in the pedestal. Through using the structure of the device of the invention, whether an installation direction is correct can be determined.

Description

technical field [0001] The invention relates to an electronic device, in particular to an installation structure of a fan body and a base in the electronic device. Background technique [0002] At present, the design of electronic devices has been moving towards the goal of thinner and smaller in recent years, and it is necessary to obtain fast and good heat dissipation in a small space. Usually, it is necessary to install a fan on the housing of the electronic device to draw out the hot air inside the housing or is a structure that sucks in cold outside air, such as figure 1 As shown, the electronic device has a housing 10, a fan 20 and a base 30. The side of the housing 10 has an opening 100. The base 30 is arranged in the housing 10 near the opening 100. The fan 20 is installed on the base 30. When the electronic When the device needs to dissipate heat, the fan 20 can generate an airflow. The internal airflow A1 is blown to the external airflow A2 by the fan 20. The dire...

AI Technical Summary

Problems solved by technology

[0002] At present, the design of electronic devices has been moving towards the goal of thinner and smaller in recent years, and it is necessary to obtain fast and good heat dissipation in a small space. Usually, it is necessary to install a fan on the housing of the electronic device to draw out the hot air inside the housing or is a structure that sucks in cold outside air, such as figure 1 As shown, the electronic device has a housing 10, a fan 20 and a base 30. The side of the housing 10 has an opening 100. The base 30 is arranged in the housing 10 near the opening 100. The fan 20 is installed on the base 30. When the electronic When the device needs to dissipate heat, the fan 20 can generate an airflow. The internal airflow A1 is blown to the external airflow A2 by the fan 20. The direction of this airflow can be selected from the inside to the outside or from the outside to the inside according to the needs of the electronic device designer. However, in The designer has determined the direction of the air flow. During assembly on the production line, because there may be no features on the fan, or even if the fan has an outlet direction mark on it, during actual assembly, the direction indicated by the arrow is still ignored and the installation is wrong.

Therefore, if the factory installs it wrongly and does not find it, it will often be found that the fan direction is wrong during the test, resulting in rework, resulting in a waste of man-hours on assembly

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