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Component mounting device and component mounting method

A technology of installation device and installation method, which is applied in the direction of electrical components, electrical components, etc., can solve the problems that it is difficult to ensure the installation quality and improve the productivity, and achieve the effect of ensuring the installation quality and improving the productivity

Active Publication Date: 2017-12-12
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, there is a problem that it is difficult to achieve both the assurance of mounting quality and the improvement of productivity in the existing component mounting line.

Method used

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  • Component mounting device and component mounting method
  • Component mounting device and component mounting method
  • Component mounting device and component mounting method

Examples

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Embodiment Construction

[0038] First, refer to figure 1 , the structure of the component mounting line 1 will be described. The component mounting line 1 has a function of mounting electronic components on a substrate by soldering to manufacture a mounted substrate, and is configured by connecting a plurality of electronic component mounting devices in series. Here, it is a configuration in which the printing device M1, the printing inspection device M2, the component mounting device M3, and the reflow device M4 are connected in series.

[0039] Hereinafter, the configuration of each device will be described. The printing device M1 has a function of printing solder paste for bonding electronic components on a substrate to be mounted, and a substrate conveying mechanism 3 for conveying a substrate 4 to be mounted along a substrate conveying direction and a substrate conveyance mechanism 3 are arranged on the upper surface of the base 2A. The substrate positioning part 5 for positioning and holding t...

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Abstract

PROBLEM TO BE SOLVED: To provide a component mounting line and a component mounting method capable of satisfying both of ensuring mounting quality and increase of the productivity.SOLUTION: A component mounting unit M3 constituting a component mounting line 1 has a component mounting section M3A that mounts electronic components onto an individual board 40 after solder printing; and a mounted component inspection section M3B that performs a predetermined inspection on the individual board 40 mounted with the components. When a defective item is found as the inspection result, the component mounting section M3A mounts a marking part 44 indicating that the individual board 40 is defective board to the individual board 40 and convey the same to a reflow unit. With this, in the inspection after the reflow, total inspection is not made but only the individual board 40 attached with the marking part 44 is subjected to an acceptability inspection. Thus, the mounting quality is ensured and productivity is increased.

Description

technical field [0001] The present invention relates to a component mounting device for manufacturing a mounting substrate by mounting electronic components on a substrate, and a component mounting method based on the component mounting device. Background technique [0002] In an electronic component mounting system that mounts electronic components on boards, boards are transported along a component mounting line composed of multiple devices such as solder printing devices and component mounting devices connected in series, and solder printing and printing are performed sequentially on boards loaded from the upstream side. Component mounting and other work processes to manufacture mounting substrates. The component mounting line is equipped with an inspection function, and judges the quality of the operation result for predetermined inspection items on the substrate after each operation process is performed (for example, refer to Patent Document 1). In the prior art shown ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/04
Inventor 石本宪一郎木原正宏
Owner PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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