Large-breadth seamless splicing method and system for laser processing

Abstract

The invention provides a large-breadth seamless splicing method and system for laser processing. The method includes the following steps that a pattern to be processed is loaded and comprises multiple splicing images; according to the splicing images of the pattern to be processed, multiple splicing zones which are matched with the pattern to be processed are selected; the splicing zones are assigned into multiple independent splicing image layers; according to a stacking sequence of the splicing image layers, the splicing images of the splicing image layers are processed one by one with lasers. Compared with the prior art, the current processing zone can be kept in the optimal scanning range of a laser galvanometer constantly, the quality and the speed of laser micro processing are ensured and repeated processing on a boundary zone image is avoided. Meanwhile, as the laser galvanometer only scans the images in the splicing zones, the galvanometer will not be idle in an empty breadth and the processing efficiency is improved.

Description

technical field [0001] The invention relates to a large-format seamless splicing method and system for laser processing, belonging to the field of laser micro-processing. Background technique [0002] Laser technology has developed rapidly in the past few decades, and the application scope and level of laser have also developed rapidly. Due to its unique advantages, laser micromachining technology plays an important role in micro-nano processing, and the gradual expansion of the processing range also puts forward higher and higher requirements for the accuracy and stability of laser micromachining technology. [0003] The laser galvanometer has the advantages of wide application range, fast processing speed, high precision, good optical path sealing and strong environmental adaptability. It has become the mainstream in laser microprocessing, and is more and more used in various laser microprocessing equipment. Among them, the quality and speed of laser micromachining are gr...

AI Technical Summary

Problems solved by technology

[0005] For example: for samples with random distribution of graphics, part of the processing pattern will cross the boundary of the splicing area. Using this splicing method will cause a pattern to be completed on more than two splicing panels, and the processing pattern at the boundary will be discontinuous. , and the smaller the processing pattern, the more obvious this phenomenon is; and because there is an overlap of about 50 microns in the border between the spliced ​​​​formats, it also produces repeated processing of the border area graphics, which greatly affects the quality and quality of laser micromachining. precision

[0006] In addition, when the areas that need to be processed are far apart on the processing surface, the splicing of the galvanometer will also allocate the splicing surface above the area that does not need to be processed. During the processing, the galvanometer will run empty on these empty surfaces, seriously affecting Processing efficiency

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