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Sensor module based on flexible substrate

A sensor module, flexible substrate technology, applied in the direction of instruments, scientific instruments, measuring devices, etc., can solve problems such as application scenario limitations, inability to meet market requirements, etc., to achieve the effect of high portability and easy placement

Active Publication Date: 2014-03-19
INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Sensors based on rigid substrates have been very mature, but their application scenarios are limited by the substrate itself and cannot meet market requirements. Therefore, flexible substrates have good development potential

Method used

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  • Sensor module based on flexible substrate
  • Sensor module based on flexible substrate
  • Sensor module based on flexible substrate

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Embodiment Construction

[0024] In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0025] The present invention provides a sensor module based on a flexible substrate. The sensor module uses flexible insulating materials such as PI and PET as the substrate, and utilizes various microelectronic micromachining methods to fabricate sensors and wireless transmitting parts on it. Taken together, a passive, wireless, foldable and highly portable assembled novel sensor module is formed.

[0026] The sensor module based on the flexible substrate provided by the present invention includes a sensor part and an antenna part, both of which are based on a flexible insulating material and connected by wires or clamps, wherein the flexible insulating material can be polyimide (PI) , polyethylene terephthalate (PET) or special paper mate...

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Abstract

The invention discloses a sensor module based on a flexible substrate. The sensor module comprises a sensor part and an antenna part, wherein the sensor part and the antenna part use flexible insulating materials as substrates, and are connected through a lead or a clamp, the sensor part is used for sensing an external sensitive signal, the antenna part is used for transmitting and receiving a wireless signal, and the sensor part and the antenna part are combined for realizing detection and transmission of the external sensitive signal under the wireless condition. According to the sensor module, by using the flexible insulating materials such as PI and PET as the substrates and using various microelectronic microprocessing methods, the sensor part and a wireless emitting part are made on the substrates and are combined with the substrates together so that the novel sensor module which is passive, wireless and foldable, is high in portability, and is assembled is formed.

Description

technical field [0001] The invention relates to the technical field of detection and transmission of sensor signals, in particular to a sensor module based on a flexible substrate for detection and transmission of sensor signals. Background technique [0002] With the development of society and the improvement of people's living standards, it is becoming more and more urgent to detect light, small and bendable sensors in the fields of food safety, medicine and health. At the same time, with the development of the Internet of Things, the society has higher and higher requirements for wireless interconnection, and wireless sensors have attracted more and more attention. Sensors based on rigid substrates have been very mature, but their application scenarios are limited by the substrate itself and cannot meet market requirements. Therefore, flexible substrates have good development potential. [0003] Most of the current wireless transmission modules are made at one time based...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N27/00G01N27/22G01N27/04
Inventor 梁圣法李冬梅李小静张浩罗庆周磊刘明谢常青杨洪璋
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI