Capacitive pressure sensor

A technology of capacitive sensors and pressure sensors, which is applied in fluid pressure measurement using capacitance changes, measuring fluid pressure through electromagnetic components, measuring fluid pressure, etc., can solve molding filling, insufficient filling, material demoulding, and excessive material overflow And other issues

Active Publication Date: 2014-03-26
DYNISCO INSTR
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the melt pressure is too low, then undermolding, underfilling and other undesirable manufacturing defects can occur
Also, if the molding pressure is too high, it can lead to excessive flash, material ejection and possible equipment failure

Method used

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Examples

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Embodiment Construction

[0031] Pressure sensors used to monitor the pressure associated with polymer melts during extrusion and injection molding processes are subject to elevated temperatures ranging up to 400° C. or higher depending on the specific polymer. The inventors have realized that exposure to such a large temperature range not only requires correction of the output temperature signal due to high temperature effects, but that these temperatures also have an adverse effect on component life. Accordingly, the present inventors have recognized a need to provide a high temperature pressure sensor probe that is capable of accurately measuring pressure while also providing increased reliability and service life. Additionally, in order to provide a higher fidelity signal with greater sensitivity, the inventors have also realized that there is a need to reduce the overall signal loss and sources of interference within the pressure sensor. Additionally, the present inventors have recognized the need...

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Abstract

High temperature pressure sensing devices and methods are disclosed. In some embodiments, a high temperature pressure sensor including intrinsic zero output and span correction versus temperature is disclosed. In addition, ways to improve high temperature performance through the use of intermediate circuits located towards the distal end of the high temperature pressure sensor as well as configurations to reduce thermally induced stresses within the pressure sensor are disclosed. The disclosed embodiments also detail ways to reduce signal loss due to various stray capacitances within the pressure sensor to improve signal fidelity and sensitivity.

Description

technical field [0001] The disclosed embodiments are generally directed to capacitance-based pressure sensors. Background technique [0002] Extrusion and injection molding of plastics are widely used to produce components for numerous industries and applications. During the manufacture of these various parts, it is important to measure the pressure and temperature of the melt within the system to ensure accurate and reproducible part production. If the melt pressure is too low, undermolding, underfilling, and other undesirable manufacturing defects can occur. Additionally, if the molding pressure is too high, it can lead to excessive flash, material ejection and possible equipment failure. As such, pressure sensors are often incorporated into one or more locations within the extrusion press or injection molding system to monitor the extrusion process or the injection process. However, polymer melt temperature ranges up to 400°C or higher depending on the specific polymer...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01L9/12G01L19/04
CPCG01L19/04G01L9/0061G01L9/0072G01L9/125Y10T29/49007
Inventor 莱奥·E·巴龙约翰·A·曹扎斯蒂
Owner DYNISCO INSTR
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