A thimble jig mechanism for semiconductor chip packaging
A chip packaging and semiconductor technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of cumbersome thimble fixture replacement process, increase production cost, and affect work efficiency, so as to save labor time and reduce labor The effect of cost and easy operation
Inactive Publication Date: 2016-08-24
ATHLETE AUTOMATION EQUIP SHANGHAI
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Problems solved by technology
In the prior art, when the size of the semiconductor chip is changed to another specification, the position of the thimble on the thimble fixture under the wafer also needs to be changed to match the size of the chip, and the position of the thimble on the thimble fixture The position is fixed, so generally the entire thimble jig is replaced, which not only causes unnecessary waste, but also the replacement process of the thimble jig is cumbersome, and requires repositioning of the replaced thimble jig and the thimble cap. Make the thimble on the thimble fixture match the thimble hole on the thimble cap, which greatly increases the labor force, affects the work efficiency, and increases the production cost
Method used
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[0028] The present invention will be further described below in conjunction with specific examples.
[0029] A thimble jig mechanism for semiconductor chip packaging, comprising a fixed thimble cap 1, a thimble jig 3 that can be raised and lowered inside the thimble cap 1, and is characterized in that:
[0030] The thimble jig 3 is composed of a cup-shaped magnet base 31, a magnet 32, a thimble block 33 and a thimble 34;
[0031] The magnet 32 is fixed inside the cup-shaped magnet seat 31 , and the thimble block 33 is arranged at the end of the cup mouth of the magnet seat 31 and is in contact with the magnet 32 . The upper end surface of the magnet base 31 is on the same level as the upper end surface of the magnet 32 . This ensures that the thimble block 33 is in full contact with the magnet 32 without leaving a gap, and better fixes and protects the thimble 34 inserted into the thimble block.
[0032] The thimble block 33 is provided with a large number of thimble...
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The invention relates to a thimble apparatus for semiconductor chips, especially to a thimble fixture mechanism for packaging of semiconductor chips. The thimble fixture mechanism comprises a fixed thimble cap and a thimble fixture which is sleeved in the thimble cap and can move up and down. The thimble fixture is composed of a cup-shaped magnet seat, a magnet, a thimble block and thimbles. The magnet is fixed inside the magnet seat. The thimble block is arranged at the cup end portion of the magnet seat and is contacted with the magnet. The thimble block is provided with thimble holes, the number of which is greater than or equal to the number of the thimbles. The thimbles pass through the thimble holes and are absorbed on the magnet. The length of the thimbles is less than the distance from the bottom of the thimble block to the upper side of the top plate of the thimble cap before jacking but is greater than the distance from the bottom of the thimble block to the lower side of the top plate of the thimble cap before jacking. The distance between the thimbles on the thimble fixture mechanism can be adjusted according to semiconductor chips of different dimensions and specifications without the need of replacing the whole thimble fixture. Thus, unnecessary waste is avoided, and production cost is reduced.
Description
technical field [0001] The invention relates to a semiconductor chip ejector device, in particular to an ejector jig mechanism used for semiconductor chip packaging. Background technique [0002] When the semiconductor chip is packaged, when the semiconductor chip is transferred from the wafe to other jigs, there is a thimble mechanism under the wafe. Eject out from the hole of the wafer, so that the relevant parts of the wafer and the chip can be pushed up, and finally the chip will be pushed up, which will greatly reduce the adhesion of the chip from the wafer. For chips of different sizes and specifications, ejector pins The location will vary. In the prior art, when the size of the semiconductor chip is changed to another specification, the position of the thimble on the thimble fixture under the wafer also needs to be changed to match the size of the chip, and the position of the thimble on the thimble fixture The position is fixed, so generally the entire thimble jig...
Claims
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IPC IPC(8): H01L21/687
CPCH01L21/6875
Inventor 王为新赵凯孙童吕海波苏浩杰
Owner ATHLETE AUTOMATION EQUIP SHANGHAI