Component positioning device
A positioning device and component technology, applied in the field of fixtures, can solve problems such as tilting or twisting, affecting the accuracy of component welding positions, and components cannot be oriented and offset, and achieve the effect of precise positioning
Active Publication Date: 2014-04-09
COMBA TELECOM SYST CHINA LTD
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Problems solved by technology
[0003] However, for components with higher position accuracy requirements, the existing placement equipment and fixtures can no longer meet the requirements of the assembly process, and the following defects exist:
[0004] (1) The placement process of the existing placement equipment is: according to the size of the pad, print solder paste on the pad, then place the components on the solder paste, and finally solder the components on the circuit board through reflow soldering. This method will cause undesirable problems such as displacement, tilting or twisting of components during welding
[0005] (2) Due to the dimensional tolerances of the existing fixtures and components, there is a certain gap when the fixture fixes the components, which will cause a certain displacement of the components in the fixture, and the components cannot be oriented. Affects the accuracy of component soldering positions
Method used
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[0014] The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.
[0015] see figure 1 and figure 2 , figure 1 and figure 2 They are respectively a three-dimensional state diagram and a side view of an embodiment when the component positioning device positions components. As shown in the figure, the component positioning device includes: a positioning block 11 , a base 12 , a first spring piece 13 and a second spring piece 14 . At the same time, in order to elaborate the working principle of the component positioning device, figure 1 and figure 2 Components 15 and circuit board 16 are also shown.
[0016] Such as image 3 As shown, the positioning block 11 includes a cross-shaped plate body 111 formed by two arms intersecting each other and bosses 112 , 113 , 114 , 115 extending longitudinally at two ends of each arm. The cross-shaped plate body 111 and each boss 112, 113, 114, 115 jointly define a groove ...
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The invention discloses a component positioning device comprising a positioning block, a base, a first leaf spring and a second leaf spring. The positioning block comprises a cross-shaped plate formed by two arms arranged in a crossed manner and bosses formed by two ends of each arm extending longitudinally. The cross-shaped plate and the bosses limit a groove used for pressing a component jointly. Through holes are formed in two bosses of the ends of one arm of the positioning block, and a screwed hole is formed in each end of one arm of the cross-shaped plate. Screwed holes corresponding to the through holes are formed in the base, and the positioning block and the base are connected through the through hole and the screwed holes in the base so as to fix the component clamped and pressed by the positioning block on a circuit board between the positioning block and the base. The first leaf spring and the second leaf spring are respectively connected to the cross-shaped plate through the screwed holes in the cross-shaped plate, are located on the same side of the cross-shaped plate, and are used for allowing the component clamped and pressed by the positioning block to move in an oriented manner. By the aid of the component positioning device, accurate positioning of the component can be realized.
Description
technical field [0001] The invention relates to the field of fixtures, in particular to a component positioning device. Background technique [0002] With the development of high-precision electronic products, the requirements for the accuracy of the soldering position of components on the circuit board are getting higher and higher. For example, simple fixtures or placement equipment in the placement process can locate the soldering position of components on the circuit board. [0003] However, for components with higher position accuracy requirements, the existing placement equipment and fixtures can no longer meet the requirements of the assembly process, and the following defects exist: [0004] (1) The placement process of the existing placement equipment is: according to the size of the pad, print solder paste on the pad, then place the components on the solder paste, and finally solder the components on the circuit board through reflow soldering. This method will ca...
Claims
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IPC IPC(8): B25B11/00
CPCB23K3/087
Inventor 刘兴现
Owner COMBA TELECOM SYST CHINA LTD