Material pick-and-place device

Abstract

An embodiment of the invention discloses a negative pressure generator. The negative pressure generator comprises a high-pressure air channel and a negative pressure channel, wherein the high-pressure air channel is communicated with an external high-pressure air flow conveying device, and the negative pressure channel is arranged on at least one side of the high-pressure air channel and communicated with the high-pressure air channel. An embodiment of the invention simultaneously further discloses a material taking and placing device. The material taking and placing device comprises the negative pressure generator, a negative pressure pipe, exhaust pipes and a first control switch, wherein one end of the negative pressure pipe is communicated with the negative pressure channel of the negative pressure generator, the exhaust pipes are arranged on one side of the negative pressure pipe at intervals side by side, one end of every exhaust pipe is communicated with the negative pressure pipe, and the first control switch controls the negative pressure pipe and the exhaust pipes to be in reverse on-off states. A suction nozzle for adsorbing materials is formed at the other end of the negative pressure pipe. The material taking and placing device is simple in structure, simple and convenient and rapid to operate and safe to use and can effectively improve operation quality, improve operation efficiency and reduce production cost.

Description

technical field [0001] The invention relates to the technical field of electronic manufacturing, in particular to a material pick-and-place device. Background technique [0002] As labor costs continue to rise, labor-intensive industries such as the electronics manufacturing industry are gradually transforming towards intelligence and automation. Among them, in the product manufacturing process, material pick-and-place devices are used to replace manual labor to grab materials and place them in designated locations for subsequent use. processing. [0003] However, most of the existing material pick-and-place devices are manipulators or robots. Most of these material pick-and-place devices are only suitable for picking and placing relatively large material devices, and are difficult to adapt to pins on circuit boards, clocks or electronic products. The demand for pick-and-place operations of various small material devices such as components and parts, but manual pick-and-pla...

AI Technical Summary

Problems solved by technology

[0003] However, most of the existing material pick-and-place devices are manipulators or robots. Most of these material pick-and-place devices are only suitable for picking and placing relatively large material devices, and are difficult to adapt to pins on circuit boards, clocks or electronic products. The demand for pick-and-place operation of various small material devices such as components, but manual pick-and-place is still required, which brings great inconvenience to the assembly and processing of such small material devices, and also increases the production cost

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