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Preparation method for corrosion-resistant hydrophobic film on metal surface

A metal surface, corrosion-resistant technology, applied in the direction of metal material coating process, coating, etc., can solve the problem that copper corrosion cannot be well inhibited, and achieve the effect of simple method, short time consumption and reduced loss

Inactive Publication Date: 2017-02-01
SHANGHAI NORMAL UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, dopamine is easy to form cracks during the polymerization process, so a pure polydopamine film cannot inhibit the corrosion of copper very well.

Method used

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  • Preparation method for corrosion-resistant hydrophobic film on metal surface
  • Preparation method for corrosion-resistant hydrophobic film on metal surface
  • Preparation method for corrosion-resistant hydrophobic film on metal surface

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] (1) Copper pretreatment: Grind the electrode on coarse sandpaper and fine sandpaper respectively to remove copper oxide on the electrode surface, then ultrasonically clean it in water, ethanol and water for 8-10 minutes, and then polish it with 0.5 micron aluminum oxide , after the copper surface forms a bright mirror surface, ultrasonically clean it again in water, ethanol and water for 8-10 minutes;

[0032] (2) Rapidly immerse the copper electrode obtained in (1) into 7M HNO 3 Soak in the solution for 10-15 seconds to remove the copper oxide formed on the copper surface during the pretreatment process, and then rinse with water and ethanol.

[0033] (3) Preparation of hydrophobic film on copper surface: immerse the above-mentioned treated copper electrode in a Tris-HCl (pH 8.5) buffer solution of 0.5 mg / mL dopamine, take it out after 2 hours and wash the remaining molecules on the surface that do not interact with copper , Then immerse the electrode in 5mM dodecyl m...

Embodiment 2

[0035] (1) Copper pretreatment: grind the electrode on coarse sandpaper and fine sandpaper respectively, remove the copper oxide on the electrode surface, then successively ultrasonically clean in water, ethanol and water for 8 minutes, then polish with 0.5 micron aluminum oxide, wait After forming a bright mirror surface on the copper surface, ultrasonically clean it again in water, ethanol and water for 8 minutes;

[0036] (2) Rapidly immerse the copper electrode obtained in (1) into 7M HNO 3 Soak in the solution for 10 seconds to remove the copper oxide generated on the copper surface during the pretreatment process, and then rinse with water and ethanol.

[0037] (3) Preparation of hydrophobic film on copper surface: immerse the above-mentioned treated copper electrode in a Tris-HCl (pH8.5) buffer solution of 0.5 mg / mL dopamine, take it out after 1 hour and rinse the remaining surface with water that does not interact with copper. Molecules, then immerse the electrode in ...

Embodiment 3

[0043] (1) Copper pretreatment: grind the electrode on coarse sandpaper and fine sandpaper respectively, remove the copper oxide on the electrode surface, then successively ultrasonically clean in water, ethanol and water for 8 minutes, then polish with 0.5 micron aluminum oxide, wait After forming a bright mirror surface on the copper surface, ultrasonically clean it again in water, ethanol and water for 8 minutes;

[0044] (2) Rapidly immerse the copper electrode obtained in (1) into 7M HNO 3 Soak in the solution for 10 seconds to remove the copper oxide generated on the copper surface during the pretreatment process, and then rinse with water and ethanol.

[0045] (3) Preparation of hydrophobic film on copper surface: immerse the above-mentioned treated copper electrode in Tris-HCl (pH 9) buffer solution of 0.3mg / mL dopamine, take it out after 1h and wash the remaining molecules on the surface that do not interact with copper , Then immerse the electrode in 4mM dodecyl mer...

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Abstract

The invention relates to a preparation method for a corrosion-resistant hydrophobic film on a metal surface. The preparation method comprises the following steps: (1) placing a pretreated metal electrode into a tris(hydroxymethyl)aminomethane buffer solution of dopamine (PDA), soaking the metal electrode and then taking the metal electrode out for cleaning; and (2) then hermetically soaking the metal electrode in a dodecylthiol (1-DT) solution so as to form the corrosion-resistant hydrophobic film on the surface of the metal electrode. Compared with the prior art, the invention has the advantages that in virtue of the viscosity of PDA and the hydrophobicity of 1-DT, PDA and 1-DT act on the surfaces of metals like copper through self-polymerization and self-assembling to inhibit corrosion of the surfaces; and the preparation method for the hydrophobic film is simple, time-saving, environment-friendlier, etc.

Description

technical field [0001] The invention relates to the field of hydrophobic film preparation, in particular to a method for preparing a corrosion-resistant hydrophobic film on a metal surface. Background technique [0002] Copper has excellent strength, machinability, thermal conductivity, electrical conductivity, weldability and corrosion resistance, and is widely used in marine related fields. Generally, copper has better corrosion resistance, but it can form coordination ions in a solution containing chloride ions, resulting in more serious corrosion. [0003] At present, the most commonly used effective inhibitor of copper corrosion is the use of organic corrosion inhibitor benzotriazole (BTA). This corrosion inhibitor has a good anti-corrosion effect on copper in different corrosive media, but this molecule is a toxic substance. polluted environment. Therefore, it is of great significance to seek new methods with good anti-rust effect, high corrosion inhibition efficienc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C26/00
CPCC23C26/00
Inventor 杨海峰魏楠应叶
Owner SHANGHAI NORMAL UNIVERSITY
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