Method for controlling instruction execution of semiconductor technology

An instruction execution and control method technology, applied in the field of semiconductor process equipment control, can solve the problems of cumbersome, unfavorable expansion, and long driver response time, and achieve the effect of avoiding multiple updates and ensuring real-time and simultaneity.

Active Publication Date: 2014-05-07
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
View PDF5 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, all command information and status information are stored in the driver module, resulting in long response time and low efficiency of the driver program. At the same time, the configuration of command information and status information can only be modified in the driver program, which is very cumbersome and not conducive to expansion.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for controlling instruction execution of semiconductor technology
  • Method for controlling instruction execution of semiconductor technology
  • Method for controlling instruction execution of semiconductor technology

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] In order to make the content of the present invention clearer and easier to understand, the content of the present invention will be further described below in conjunction with the accompanying drawings. Of course, the present invention is not limited to this specific embodiment, and general replacements known to those skilled in the art are also covered within the protection scope of the present invention.

[0023] figure 1 A block diagram of a control device for executing instructions of the semiconductor process of the present invention; figure 2 It is a flow chart of the control method for the instruction execution of the semiconductor process of the present invention, which will be combined below figure 1 and figure 2 The instruction execution control device and control method of the present invention will be described.

[0024] The instruction execution control device of the present invention is used for receiving instructions from a host computer during the ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a method for controlling instruction execution of a semiconductor technology. The method includes the steps of establishing instruction objects corresponding to instructions and state objects corresponding to the instructions, wherein instruction information of the instructions corresponding to the instruction objects is stored in the instruction objects, and state information of the instructions corresponding to the state objects is stored in the state objects and comprises instruction completion conditions and instruction execution states; receiving the instructions sent by an upper computer, controlling a semiconductor device to execute the instructions according to the instruction information stored in the instruction objects corresponding to the instructions, updating the instruction execution states in the state objects when the instruction completion conditions stored in the state objects corresponding to the instructions are met, and when the instruction execution states are updated, outputting the updated instruction execution states to the upper computer. According to the method, multithreading execution of the instructions and feedback of the execution states can be achieved.

Description

technical field [0001] The invention relates to the technical field of semiconductor process equipment control, in particular to a control method for command execution. Background technique [0002] At present, the communication between the upper computer and the lower computer in the semiconductor process is realized by the upper computer sending instructions to the lower computer, and the lower computer returning the status to the upper computer. A common method of driving instruction execution adopts a sequential structure design, that is, only one instruction can be executed or a status can be returned at a time, and the instruction information of the next instruction is read after completing one instruction. In addition, all command information and status information are stored in the driver module, resulting in long response time and low efficiency of the driver program. At the same time, the configuration of command information and status information can only be modif...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G05B19/418
CPCY02P90/02
Inventor 黄扬君魏靖南贾轶群刘建涛
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products