Organic transparent photoelectric panel capable of being upgraded by stacking and splicing and its application method
An application method and technology of transparent conductive film, which is applied in the field of organic transparent photoelectric panels, can solve problems such as difficulty in replacement and limited applicability, and achieve the effects of reducing use costs, perfect functions, and convenient installation and maintenance
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Embodiment 1
[0038] Such as figure 1 Shown is the photoelectric panel of the present invention, in which a layer of transparent substrate 111 is coated with a circuit layer 112; on the circuit layer 112, multiple groups of photoelectric devices 121 are mounted, and each photoelectric device 121 is provided with a bottom electrode 122 and The circuit layer 112 is electrically connected; wherein, the optoelectronic device 121 is mounted on the circuit layer 112 through the intermediate layer 132 . On the layer of transparent substrate 111 without circuit layer 112, a protruding structure matching the shape of each optoelectronic device 121 is produced by vacuum molding or molding, and other parts of the protruding structure are removed between the two transparent substrates 111. Apply a transparent adhesive layer 133 at the position to form a stable bonding structure between the two layers of transparent substrates 111, and apply a layer of adhesive layer on the back of the flat transparent ...
Embodiment 2
[0041] Such as figure 2 Shown is the photoelectric panel of the present invention, in which a layer of transparent substrate 111 is coated with a circuit layer 112; on the circuit layer 112, multiple groups of photoelectric devices 121 are mounted, and each photoelectric device 121 is provided with a bottom electrode 122 and The circuit layer 112 is electrically connected; wherein, the optoelectronic device 121 is mounted on the circuit layer 112 through the intermediate layer 132 . A transparent filling intermediate layer 135 is provided between the two layers of transparent substrates 111 except for the photoelectric device 121 .
[0042] In this embodiment, the adhesive layer 131 is coated on the back of the layer of transparent substrate 111 provided with the circuit layer 112, which can make the photoelectric panel and the wall 110 (glass curtain wall or window, etc.) be pasted well; An intermediate layer 132 made of a conductive adhesive material or solder material is ...
Embodiment 3
[0044] Such as image 3 Shown is the photoelectric panel of the present invention, in which a layer of transparent substrate 111 is coated with a circuit layer 112; on the circuit layer 112, multiple groups of photoelectric devices 121 are mounted, and each photoelectric device 121 is provided with a bottom electrode 122 and The circuit layer 112 is electrically connected; wherein, the optoelectronic device 121 is mounted on the circuit layer 112 through the intermediate layer 132 . A transparent filling intermediate layer 135 is provided between the two layers of transparent substrates 111 except for the photoelectric device 121 .
[0045] In this embodiment, the adhesive layer 131 is coated on the back of the transparent substrate 111 without the circuit layer 112, so that the photoelectric panel and the wall 110 (glass curtain wall or window, etc.) can be pasted well; An intermediate layer 132 made of a conductive adhesive material or solder material is provided between th...
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