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Light emitter packages and devices having improved wire bonding and related methods

A technology for light emitters and packages, which is applied in the direction of semiconductor devices, electric solid devices, electrical components, etc., and can solve problems such as high and high thermal impedance, affecting the performance of LED chips, and not being improved.

Active Publication Date: 2014-05-07
CREELED INC (N D GES D STAATES DELAWARE NEWARK)
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When epoxy is used, this high temperature can create thermal stress on the LED chip and / or high thermal impedance at the LED chip / substrate junction, either of which can adversely affect the performance of the LED chip
On the one hand, there is a negative impact on brightness and forward voltage (Vf), both of which are not recoverable
Traditional packages and methods for high temperature use, unmodified wire bonding can result in high thermal resistance of about 220°C / W or more

Method used

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  • Light emitter packages and devices having improved wire bonding and related methods
  • Light emitter packages and devices having improved wire bonding and related methods
  • Light emitter packages and devices having improved wire bonding and related methods

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Embodiment Construction

[0013] Reference will now be made in detail to possible aspects or embodiments of the invention, one or more examples of which are illustrated in the accompanying drawings. Each example is provided by way of explanation of the invention, not limitation. Indeed, features illustrated or described as part of one embodiment can be used on another embodiment to yield a still further embodiment. The invention disclosed and conceived herein is intended to cover such modifications and variations.

[0014] As shown in the various drawings, the size of some structures or portions are exaggerated relative to other structures or portions for illustrative purposes, and thus, serve to illustrate the general structure of the present invention. Furthermore, various aspects of the invention have been described with reference to structures or portions formed on other structures, portions, or structures and portions. As will be understood by those skilled in the art, for a structure to be form...

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Abstract

Light emitter packages and devices having improved wire bonding and related methods are disclosed. In one embodiment, a light emitter package can include at least one light emitting diode (LED) chip electrically connected to an electrical element via a wire bond. The wire bond can be provided at improved wire bonding parameters such as a temperature of approximately 150 DEG C or less, a bonding time of approximately 100 ms or less, a power of approximately 1,700 mW or less, and a force of approximately 100 grams force (gf) or less, or combinations thereof.

Description

[0001] Cross References to Related Applications [0002] This application claims priority to US Provisional Patent Application 61 / 531,483, filed September 6, 2011, the entire contents of which are hereby incorporated by reference. technical field [0003] The invention disclosed herein relates generally to wire bonding of light emitter devices, such as light emitting diode (LED) chips. More specifically, the invention disclosed herein relates to providing improved wire bonded light emitter devices and methods for improved thermal impedance. Background technique [0004] Light-emitting devices such as light-emitting diodes (LEDs or LED chips) are currently used in many different general lighting applications and systems, for example, in lamps intended to replace incandescent, fluorescent and metal halide high-intensity discharge (HID) products. product. Thermal management and heat dissipation within LED packages is an area of ​​concern for LED chip and / or LED package manufa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/62H01L33/48
CPCH01L24/29H01L24/45H01L24/83H01L24/85H01L25/0753H01L24/32H01L24/48H01L24/78H01L2224/32225H01L2224/32245H01L2224/2929H01L2224/29339H01L2224/29191H01L2224/2919H01L2224/78301H01L2224/48465H01L2224/48091H01L2224/48227H01L2224/48247H01L2224/73265H01L2224/49113H01L2224/45565H01L2224/45644H01L2224/45147H01L2224/45144H01L2224/45139H01L2224/45015H01L2924/12041H01L2924/10155H01L2924/01029H01L2924/01047H01L2924/01006H01L2924/01013H01L2924/01014H01L2924/01322H01L2224/92247H01L2224/85181H01L2224/85205H01L2224/8385H01L2933/0033H01L2933/0066H01L2924/3011H01L2924/20102H01L2924/20103H01L2924/20104H01L2924/00014H01L2924/0665H01L2924/01204H01L2924/0105H01L2224/45669H01L2924/20752H01L2924/20753H01L2924/20755H01L2924/00H01L2924/00012H01L2924/00011H01L2924/013H01L2924/351H01L2224/85099H01L24/73H01L24/49H01L2224/05552H01L2224/05554H01L2924/2075H01L2924/20754H01L2224/43848H01L33/48
Inventor 彼得·斯科特·安德鲁斯朱晟喆
Owner CREELED INC (N D GES D STAATES DELAWARE NEWARK)
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