Novel LED lighting device

Abstract

The invention provides an LED lighting device which comprises a base, a light-emitting chip, a circuit coating layer and a lamp cover. The base is of a hollow-out structure. The circuit coating layer is directly arranged on the upper surface of the base in a coating mode. The light-emitting chip is directly attached on the base and is connected with the base through the circuit coating layer. The lamp cover is arranged on the base and wraps the light-emitting chip and the circuit coating layer. The inner surface of the lamp cover comprises a light distributing face and a heat conducting face which is tightly attached with the base. The lamp cover is made of solid materials with good heat conductivity, meanwhile, the hollow-out base and a radiating through hole are used, heat generated by the chip can be conducted out through the base and the lamp over outwards and then is taken out by air circulating through the hollow-out structure and the through hole, accordingly, the whole device can carry out radiating in all directions, the radiating performance of the device is greatly improved, due to improvement of the radiating performance, a lighting device with higher power can be manufactured under the situation that device size is not increased, and the illuminating brightness of the device is improved.

Description

technical field [0001] The present invention relates to LEDs, and in particular, to a novel LED lighting device. Background technique [0002] The application of LED technology to lighting systems has gradually become a mainstream trend, but the heat dissipation of LED lighting devices has always been a difficult problem in the industry, which also limits the manufacture of high-power LED devices, resulting in insufficient brightness of a single LED light source and display-type LED lighting fixtures are too bulky. A traditional LED light-emitting unit usually includes: a packaging part, a light-emitting chip, a light source support (also called a substrate), a circuit board, and a heat sink. It can be seen that in the traditional LED light-emitting unit, the heat generated by the light-emitting chip needs to pass through the "chip - light source bracket - electrical layer on the surface of the circuit board - circuit board - thermal grease - heat sink" in sequence. The pa...

AI Technical Summary

Problems solved by technology

The packaging materials of traditional technology generally use resin materials, which have poor thermal conductivity, so that the heat generated by the chip cannot be exported through the direction of the packaging components, and can only rely on the radiator for heat conduction in one direction

In addition, in the production of bulb lamps, the chip usually has an independent package, and then is covered with a hollow outer cover to form the shape of the bulb lamp, so that the heat generated by the chip needs to be transferred to the air through the independent package. Then to the housing and then to the surrounding air, making it almost impossible to get the heat out

In addition, most of the bases of traditional LED lighting devices use scales to increase the heat dissipation area, and the heat dissipation results are not satisfactory.

Some newer LED lamps use a hollowed-out base to increase heat dissipation efficiency by taking away heat through air circulation, which plays a better role. However, due to the large amount of heat generated by LED light-emitting chips, the heat dissipation effect of this method is limited. It is still impossible to manufacture larger power LED lighting fixtures within the volume range

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