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Apparatus for maintaining internal cleanliness of interface unit

A technology of interface unit and cleanliness, which is applied in the field of wafer coating and developing production in the semiconductor industry, can solve the problems of internal cleanliness decline, waste of production time, energy consumption, etc., and achieve the effect of saving money, increasing production capacity, and low price

Inactive Publication Date: 2014-05-14
SHENYANG KINGSEMI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At this stage, the design of the connection side of the interface unit with TRACK or lithography machine is open. When it is removed, the interface unit is directly exposed to the production environment, resulting in a decrease in internal cleanliness. Before resuming production, internal delivery is required to ensure the cleanliness index. wind dust removal
The air supply and dust removal operation generally takes 30-40 minutes. This operation not only consumes energy but also wastes production time, and constitutes a certain obstacle to the high-speed and high-quality production mode required now.

Method used

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  • Apparatus for maintaining internal cleanliness of interface unit
  • Apparatus for maintaining internal cleanliness of interface unit
  • Apparatus for maintaining internal cleanliness of interface unit

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Embodiment Construction

[0020] The present invention will be further described below in conjunction with the accompanying drawings.

[0021] The present invention is arranged on the openings on both sides of the interface unit connected with TRACK and the lithography machine, and includes a shielding baffle and a driving device connected thereto, and the shielding baffle is driven by the driving device to close or open the interface unit and TRACK and the lithography machine For the connected opening, a sealing device is provided at the joint between the shielding baffle and the frame inner wall of the opening of the interface unit. The driving device is arranged on the inner wall of the frame 1 of the interface unit, and the driving device is connected with the TRACK host, and its action is controlled by the TRACK host. The driving device can adopt a cylinder device or a motor. The TRACK host is an existing technology.

[0022] like figure 1 As shown, the present invention is provided at the devi...

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Abstract

The invention belongs to wafer gluing development production field in semiconductor industry and specifically relates to an apparatus for maintaining internal cleanliness of an interface unit. The apparatus is arranged at opening portions on the two sides of an interface unit connected with a TRACK and a lithography machine, comprises a shielding baffle plate and a driving device connected with the shielding baffle plate. The shielding baffle plate closes or opens the opening portions, connected with the TRACK and the lithography machine, of the interface unit by means of the driving the driving device. The driving device is disposed on the inner wall of a framework of the interface unit. A sealing device is disposed at a joint of the shielding baffle plate and the inner wall of the framework of the opening portions of the interface unit. The apparatus effectively resolves a problem that the opening portions on the two sides of the interface unit are directly exposed to a production environment so as to result in decrease in internal cleanliness of the interface unit, and greatly improves actual production efficiency.

Description

technical field [0001] The invention belongs to the field of wafer gluing and development production in the semiconductor industry, in particular to a device for maintaining the cleanliness inside an interface unit. Background technique [0002] In the production process of semiconductor front-end process wafers, the requirements for the cleanliness of the production environment and wafer capacity are very strict. Under normal circumstances, the cleanliness of the clean room is 100, while the internal cleanliness of TRACK (glue development equipment) is required to be 1; at the same time, the mainstream index of TRACK production capacity in the 90nm process is 150WPH (Wafer per Hour). In the actual production of TRACK and lithography machines, equipment shutdowns are often caused by internal equipment failures or regular equipment maintenance. In this state, the interface unit connected to the lithography machine as TRACK needs to be removed for the operator to work. At th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00
CPCH01L21/67196
Inventor 王继周张爽胡延兵门恩国
Owner SHENYANG KINGSEMI CO LTD
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