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Shunting and pressurizing device and method for semiconductor equipment

A supercharging device and semiconductor technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as unsatisfactory product qualification rate, high cost, and reduced production capacity

Pending Publication Date: 2021-08-31
钟兴进
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the production process of semiconductor front-end process wafers, due to the complexity and high cost of the process, the requirements for wafer production capacity and pass rate are very strict. As a result, the production capacity is reduced and the product qualification rate cannot be met. In the existing technology, the air supply system directly exhausts the air to the work area, but the distribution and unevenness of the air supply system cannot meet the wafer process requirements, and multiple adjustments are required. Seriously Affect the operation time and reduce the rate of qualified products

Method used

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  • Shunting and pressurizing device and method for semiconductor equipment
  • Shunting and pressurizing device and method for semiconductor equipment
  • Shunting and pressurizing device and method for semiconductor equipment

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Embodiment Construction

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0028] see Figure 1-3 , a split booster device for semiconductor equipment of the present invention includes a first air supply system 1, a split system 2, a wind speed controller 4, and a power supply module 5, the first air supply system 1 is connected to the split system 2, and the The distribution system 2 includes a distribution pipe 3 and a second air supply system 18, the distribution system 2 is provided with a distribution air outlet, and a baffle is...

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Abstract

The invention relates to the field of semiconductors, in particular to a shunting and pressurizing device and method for semiconductor equipment. The device comprises a first air supply system, a shunting system, an air speed controller and a power supply module. Theair flow is adjusted by the first air supply system and the second air supply system for shunting and pressurizing, a shunting area and a detention area are arranged in the shunting area, so that the uniformity of the air flow in the operation area is guaranteed, the reprocessing time is saved to a great extent, the equipment adjusting period is shortened, the first air supply system and the second air supply system are conveniently controlled through the air speed controller, the operation convenience and the uniformity of the air flow distribution in the operation area are effectively improved, the angles of the vertical shunting rods and the transverse shunting rods on the shunting air outlet and the exhaust outlet are adjusted through the first rotating motor and the second rotating motor, so that the air flow and uniformity of the air supply system are systematically distributed, the technological precision requirement of equipment for the air flow is improved, and the actual production efficiency is improved.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular to a split booster device and method for semiconductor equipment. Background technique [0002] In the production process of semiconductor front-end process wafers, due to the complexity and high cost of the process, the requirements for wafer production capacity and pass rate are very strict. As a result, the production capacity is reduced and the product qualification rate cannot be met. In the existing technology, the air supply system directly exhausts the air to the work area, but the distribution and unevenness of the air supply system cannot meet the wafer process requirements, and multiple adjustments are required. Seriously Affect the operation time and reduce the rate of qualified products. Contents of the invention [0003] (1) Solved technical problems [0004] Aiming at the deficiencies of the prior art, the present invention provides a flow splitting booster device an...

Claims

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Application Information

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IPC IPC(8): H01L21/67
CPCH01L21/67253H01L21/67248
Inventor 钟兴进
Owner 钟兴进
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