Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Air filter and rectification device for semiconductor equipment

A rectifier and semiconductor technology, applied in the fields of semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of uneven air flow, influence of wafer process accuracy, etc., to ensure uniformity, save reprocessing time, improve The effect of process precision requirements

Active Publication Date: 2018-06-19
SHENYANG KINGSEMI CO LTD
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This device solves the problem that the accuracy of the wafer process is easily affected by the existing equipment due to the uneven air flow of the air supply system

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Air filter and rectification device for semiconductor equipment
  • Air filter and rectification device for semiconductor equipment
  • Air filter and rectification device for semiconductor equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0020] Such as figure 2 As shown, the present invention is installed on the side of the air supply system of semiconductor equipment, and is located between the air supply system 1 and the work area, including the air filter rectifier box 3 and the rectifier plate 5, wherein one side of the air filter rectifier box 3 is provided with The air inlet 7 of the air filter rectifier box corresponding to the air supply system 1, the bottom of the air filter rectifier box 3 is evenly distributed with a plurality of outlets of the air filter rectifier box. The rectifying plate 5 is vertically arranged in the air filtering rectifying box 3 , and its upper side is connected with the top of the filtering air rectifying box 3 . The uneven air flow provided by the air supply system 1 enters the air filter rectifier box 3 through the air inlet 7 of the air filter rectifie...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the production field of the semiconductor industry, in particular to an air filter and rectification device for semiconductor equipment. The device is arranged between the air supply system and the working area, and includes an air filter rectifier box and a rectifier plate, wherein an air inlet of the filter air rectifier box corresponding to the air supply system is provided on one side of the filter air rectifier box, and the filter air rectifier box The bottom of the air rectifier box is evenly distributed with multiple outlets of the air filter rectifier box, and the rectifier plate is vertically arranged in the air filter rectifier box, and the upper side is connected with the top of the filter air rectifier box; the uneven air flow provided by the air supply system is provided by The air inlet of the filter air rectifier box enters the air filter rectifier box, and the rectification adjustment of the rectification plate makes the air flow evenly distributed, and the uniform air flow is discharged from the air outlet of the filter air rectifier box and transported to the work area. The invention satisfies the technical requirements for the uniformity of air flow in each unit operation area of ​​the semiconductor equipment, shortens the installation and adjustment period of the semiconductor equipment, saves the operation time of the whole machine, and satisfies the purpose of effective operation precision of the wafer process.

Description

technical field [0001] The invention relates to the production field of the semiconductor industry, in particular to an air filter and rectification device for semiconductor equipment. technical background [0002] In the production process of semiconductor front-end process wafers, due to the complexity and high cost of the process, the requirements for wafer production capacity and pass rate are very strict. In the actual production of semiconductor equipment, the production capacity is often reduced due to the unevenness of temperature, humidity and air flow inside the equipment, and the product qualification rate cannot be met. In this case, as an air filter and rectification device in semiconductor equipment, it can quickly meet the process requirements and reduce the equipment adjustment period. At present, the air supply system directly exhausts air to the working area, and the air flow is uneven, such as figure 1 shown. However, the unevenness of the air supply sy...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
Inventor 郭聪胡延兵
Owner SHENYANG KINGSEMI CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com