Cleaning liquid for removing photoresist residues
A cleaning solution and residue technology, applied in the field of cleaning solution, can solve the problems of small operating window and low flash point
Active Publication Date: 2014-05-21
宁波安集微电子科技有限公司
View PDF9 Cites 7 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
However, the solvent system selected for this type of cleaning solution has a low flash point, and its
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Login to View More
PUM
Property | Measurement | Unit |
---|---|---|
Flash point | aaaaa | aaaaa |
Login to View More
Abstract
The invention provides cleaning liquid for removing photoresist residues and constitution of the cleaning liquid. The cleaning liquid for removing the photoresist residues contains sulfolane, diglycolamine and an auxiliary solvent. The cleaning liquid for removing the photoresist residues does not contain water, hydroxylamine or fluorides, can clean the difficultly-removed photoresist residues on a wafer under high operating temperature without corroding base materials such as metals comprising aluminum, silver, titanium and tungsten and non metals comprising silicon dioxide, gallium nitride and the like, and has a good application prospect in the fields of semiconductor and LED (light emitting diode) wafer cleaning and the like.
Description
technical field [0001] The invention relates to a cleaning solution, more specifically to a cleaning solution for removing photoresist residues. Background technique [0002] In the usual LED and semiconductor manufacturing processes, a photoresist mask is formed on the surface of some materials, and the pattern is transferred after exposure. After the required pattern is obtained, the remaining photoresist needs to be stripped before the next process. Engraving. This process requires complete removal of unwanted photoresist without etching any substrate. [0003] At present, the photoresist cleaning solution is mainly composed of polar organic solvents, strong alkali and / or water, and the photoresist on the semiconductor wafer is removed by immersing the semiconductor wafer in the cleaning solution or rinsing the semiconductor wafer with the cleaning solution. Improving the removal ability of photoresist has always been the priority direction of efforts to improve photore...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More
IPC IPC(8): G03F7/42
Inventor 刘兵彭洪修孙广胜颜金荔徐海玉
Owner 宁波安集微电子科技有限公司
Who we serve
- R&D Engineer
- R&D Manager
- IP Professional
Why Patsnap Eureka
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com