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Flexible touch sensors with fine-pitch interconnects

A multi-layer structure, metal conductive layer technology, applied in the layer field, can solve problems such as low yield

Inactive Publication Date: 2017-08-29
3M INNOVATIVE PROPERTIES CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Precise alignment between row and column electrodes is important, otherwise low yields will result
Furthermore, the formation of air bubbles and air gaps cannot be avoided during the lamination process

Method used

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  • Flexible touch sensors with fine-pitch interconnects
  • Flexible touch sensors with fine-pitch interconnects
  • Flexible touch sensors with fine-pitch interconnects

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] Embodiment 1 is a method comprising: providing a multilayer structure having two opposing sides and comprising a central polymeric UV transparent substrate having two major opposing surfaces, on the two major opposing sides of the polymeric substrate a transparent conductive layer on each of the surfaces, and a metal conductive layer on each transparent conductive layer; applying and patterning a first photoimaging layer on the two metal conductive layers to form a photoimaging mask of the desired pattern; etching the metal conductive layer and the portion of the transparent conductive layer exposed by the photoimaging mask; clearing the photoimaging mask; applying and patterning a second photoimaging layer on the remaining portion of each metal conductive layer layer to form a photoimaging mask for the desired pattern of the metal conductive layer; and etching exposed portions of the metal conductive layer.

Embodiment 2

[0054] Embodiment 2 is a method comprising: providing a multilayer structure having two opposing sides and comprising a central polymeric UV transparent substrate having two major opposing surfaces, on both sides of the polymeric substrate a transparent conductive layer on each of the major opposing surfaces, and a metal conductive layer on each transparent conductive layer; applying and patterning a first photoimaging layer on the two metal conductive layers to form a transparent conductive layer having and a photoimaging mask of the desired pattern of the metal conductive layer; etching the metal conductive layer and the portion of the transparent conductive layer exposed by the photoimaging mask; clearing the photoimaging mask; applying and patterning on the remaining portion of each metal conductive layer etching the second photoimaging layer to form a photoimaging mask protecting the desired pattern of the metal conducting layer; and etching exposed portions of the metal c...

Embodiment 3

[0055] Embodiment 3 is the method of embodiment 1 or embodiment 2, wherein the substrate of the central polymer is selected from the group consisting of polyester, polycarbonate, liquid crystal polymer, polyimide, and polyethylene naphthalate.

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Abstract

Articles comprising a multilayer structure, such as, for example, a touch sensor, the article having two opposing sides and comprising a central polymeric UV transparent substrate, a transparent substrate on each of the two major opposing surfaces of the polymeric substrate conductive layers, a metal conductive layer on each transparent conductive layer, and a patterned photoimaging mask on each metal conductive layer.

Description

Background technique [0001] Touch-sensitive devices have become an increasingly common way for users to interact with electronic systems, especially electronic systems including tablets, touch-screen mobile phones, and other commercial touch-interaction systems. Touch-sensitive devices allow users to conveniently interact with electronic systems and displays by reducing or eliminating the need for mechanical buttons, keypads, keyboards, and pointing devices. For example, the user only needs to touch the instant touch screen at the position identified by the icon to execute a series of complex instructions. [0002] There are several types of technologies used to implement touch-sensitive devices including, for example, resistive, infrared, capacitive, surface acoustic wave, electromagnetic, near-field imaging, and others. Capacitive touch-sensitive devices have been found to work extremely well in a number of applications. In many touch-sensitive devices, input is sensed whe...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F3/041
CPCG06F3/0445G06F3/0446G06F3/041G06F2203/04102H05K1/0274H05K1/09H05K3/06H05K2201/0302H05K2201/032
Inventor 穆图·塞巴斯蒂安多米尼克·M·特拉瓦索南希·S·伦霍夫史蒂文·T·斯沃茨
Owner 3M INNOVATIVE PROPERTIES CO