Flexible touch sensors with fine-pitch interconnects
A multi-layer structure, metal conductive layer technology, applied in the layer field, can solve problems such as low yield
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Embodiment 1
[0053] Embodiment 1 is a method comprising: providing a multilayer structure having two opposing sides and comprising a central polymeric UV transparent substrate having two major opposing surfaces, on the two major opposing sides of the polymeric substrate a transparent conductive layer on each of the surfaces, and a metal conductive layer on each transparent conductive layer; applying and patterning a first photoimaging layer on the two metal conductive layers to form a photoimaging mask of the desired pattern; etching the metal conductive layer and the portion of the transparent conductive layer exposed by the photoimaging mask; clearing the photoimaging mask; applying and patterning a second photoimaging layer on the remaining portion of each metal conductive layer layer to form a photoimaging mask for the desired pattern of the metal conductive layer; and etching exposed portions of the metal conductive layer.
Embodiment 2
[0054] Embodiment 2 is a method comprising: providing a multilayer structure having two opposing sides and comprising a central polymeric UV transparent substrate having two major opposing surfaces, on both sides of the polymeric substrate a transparent conductive layer on each of the major opposing surfaces, and a metal conductive layer on each transparent conductive layer; applying and patterning a first photoimaging layer on the two metal conductive layers to form a transparent conductive layer having and a photoimaging mask of the desired pattern of the metal conductive layer; etching the metal conductive layer and the portion of the transparent conductive layer exposed by the photoimaging mask; clearing the photoimaging mask; applying and patterning on the remaining portion of each metal conductive layer etching the second photoimaging layer to form a photoimaging mask protecting the desired pattern of the metal conducting layer; and etching exposed portions of the metal c...
Embodiment 3
[0055] Embodiment 3 is the method of embodiment 1 or embodiment 2, wherein the substrate of the central polymer is selected from the group consisting of polyester, polycarbonate, liquid crystal polymer, polyimide, and polyethylene naphthalate.
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Abstract
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