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A horizontal electroplating tank device that realizes uniform distribution of metal strip coating thickness

A coating thickness and uniform distribution technology, applied in the field of metal strip electroplating process equipment, can solve the problems of uneven lateral distribution of coating thickness, quality defects, etc., and achieve the effect of uniform distribution and good coating quality

Active Publication Date: 2016-10-05
BAOSHAN IRON & STEEL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Therefore, the technical problem to be solved by the present invention is to provide a horizontal electroplating tank device suitable for the production of thin coatings on continuous metal strips, and the coating thickness of the metal strips is evenly distributed. Due to the uneven distribution of the fluid, the uneven lateral distribution of the coating thickness results in quality defects.

Method used

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  • A horizontal electroplating tank device that realizes uniform distribution of metal strip coating thickness
  • A horizontal electroplating tank device that realizes uniform distribution of metal strip coating thickness
  • A horizontal electroplating tank device that realizes uniform distribution of metal strip coating thickness

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Embodiment Construction

[0024] Horizontal electroplating tank of the present invention such as image 3 shown. The metal strip 1 passes through the plating tank device, and there are a pair of rollers in the front and back of the plating tank, the upper roller is the conductive roller 2, and the lower roller is the backup roller 3. Anode plate components 4 are arranged on the upper and lower surfaces of the metal strip, and the outside of the electroplating area is a tank body 5 for collecting the backflow of the electroplating solution. The electroplating solution 6 enters the upper and lower electroplating areas from the middle liquid inlet pipe 7 of the electroplating tank, and flows back into the circulation system outside the plating tank through the liquid outlet pipe 8 . The frame where the upper and lower anodes are installed in the anode plate assembly 4 is designed to have a buffer cavity structure. A buffer cavity structure is provided at the inlet of the electroplating solution. Before ...

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Abstract

The invention discloses a horizontal-type electroplating tank device for realization of homogeneous thickness distribution of a coating of a metal band, the horizontal-type electroplating tank device comprises a tank body and a metal band therein, an upper and a lower electroplating zone are formed by the upper and the lower surface of the metal band and a positive pole vertically arranged in the horizontal-type electroplating tank device, the upper and the lower electroplating zone are provided with a liquid inlet pipe and a liquid outlet pipe for inflow and outflow of an electroplating liquid, a buffer cavity is arranged at an inflow port of the electroplating liquid, a buffer damping plate is arranged in the buffer cavity, a plurality of through holes of different diameters are processed on the buffer damping plate, the electroplating liquid flows through the buffer cavity to a zone close to the metal band, and then enters respectively into the upper and lower electroplating zone. By designing of the buffer cavity and the buffer damping plate, homogenization treatment of transverse distribution of a fluid in a space segment of the buffer cavity can be realized, wherein the space segment is close to the metal band, the treated fluid enters into the upper and lower electroplating zone so as to achieve transverse homogeneous distribution of the obtained coating.

Description

Technical field [0001] The invention relates to the field of metal strip electroplating process equipment, and specifically relates to a method for controlling the uniform lateral distribution of coating thickness during continuous electroplating of metal on both sides of the metal strip on a continuous metal strip processing production line. Background technique [0002] In order to improve the surface properties of metal strips, industrial users sometimes need to plate a layer of metal on the surface of the metal strip through electroplating. For example, in the nickel plating process on the surface of steel plates, the thickness of the nickel plating layer is usually only 100mg / m 2 . The purpose of nickel plating is either to improve the corrosion resistance of the surface of the metal strip, or as a pretreatment method to eliminate defects on the surface of the metal strip to prepare for the next step of electroplating other metals. The aforementioned coating thickness ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D7/06
Inventor 唐成龙黄胜标李俊张文麒徐成
Owner BAOSHAN IRON & STEEL CO LTD
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