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A wafer handling robot

A technology for handling robots and wafers, which is applied to mechanical equipment, conveyor objects, transportation and packaging, etc. It can solve problems such as long time spent, reduced assembly accuracy, and waste of space, and achieve the effect of reducing losses

Active Publication Date: 2016-06-08
HIWIN TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] 1. The displacement of the column is driven by the two rails and the ball screw. When assembling the aforementioned mechanism, the assembly accuracy between the rail and the ball screw will affect the accuracy of the column displacement. In such a narrow space, the rail and the ball screw must be corrected. It is very difficult to achieve the accuracy between them, and it takes a long time, which relatively increases the manufacturing cost of the robot.
[0005] 2. Because the ball screw and the track are separated, the assembly accuracy between the ball screw and the track will gradually decrease due to long-term use, which will relatively affect the accuracy of the column displacement
[0006] 3. The designed position of the motor assembly is likely to cause waste of space, which cannot reduce the overall size of the robot, and will also increase the use of robot materials

Method used

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  • A wafer handling robot
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Embodiment Construction

[0059] In order to further explain the technical solution of the present invention, the present invention will be described in detail below through specific examples.

[0060] First, see Figure 1A , Figure 1BIt is the linear module system diagram and combination diagram of the present invention, and the two diagrams illustrate that the linear module 5 includes: a U-shaped track 50, a first end seat 54, a second end seat 55, a screw rod 52, a slider 51, The first return system S1, the second return system S2, a plurality of first rolling elements 53 and second rolling elements, the U-shaped track 50 is elongated in one direction, and the direction is defined as the axial direction X. The U-shaped track 50 The inner surface is provided with a plurality of linear first rolling grooves 501. The first end seat 54 and the second end seat 55 are respectively provided at both ends of the U-shaped track 50 in the axial direction X. The first end seat 54 is provided with a The first ...

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Abstract

The invention relates to a wafer transport robot which comprises a base, an upright and a linear module. The linear module is arranged on the base; the linear module comprises a U-shaped rail, a sliding block and a screw; the screw drives the sliding block to move; the U-shaped rail guides the sliding block to linearly move; the sliding block is connected with the upright and drives the upright to move; and the linear module can immediately calibrate relative accuracy between the screw and the U-shaped rail without carrying out calibration again in the base of the robot, so that internal structure design of the robot also can be simplified to reduce use and processing cost of materials.

Description

technical field [0001] The invention relates to an industrial robot, especially a wafer handling robot used in the semiconductor industry. Background technique [0002] In order to reduce labor costs and increase output in the semiconductor manufacturing process, a variety of robots are used to assist in the handling of objects, and the existing common wafer handling robot mechanism, such as China Taiwan Patent No. 483807, in this case, the column is loaded and fixed on the On a rotating part of a shoulder transmission part, and the transmission part is supported in a linear transmission part so that the transmission part and the column can linearly translate along the Z axis. In detail, the linear transmission part includes: two tracks, a carrier, a ball screw and a motor assembly. screw, the track is used to guide the linear displacement of the frame, and the ball screw is used to move the carrier vertically, and the carrier drives the column to linearly translate along t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F16H25/22F16H37/00H01L21/677
CPCF16H25/2204F16H37/02H01L21/677
Inventor 王福清江宗宪张耀仁
Owner HIWIN TECH