LED (light-emitting diode) series SMT (surface-mount technology) suction nozzle and manufacturing process thereof

A series and nozzle technology, applied in the field of LED series SMT nozzles, can solve the problems of LED sticking to the nozzles, anti-adhesion, low throwing rate, etc., to avoid scratches, reduce defective rates, and save costs.

Inactive Publication Date: 2014-06-18
JIUJIANG JIAYUAN TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a LED series SMT suction nozzle and its manufacturing process, which solves the problem that LEDs are easy to cause LEDs to stick to the suction nozzle during the SMT mounting process, and has anti-adhesive pr

Method used

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  • LED (light-emitting diode) series SMT (surface-mount technology) suction nozzle and manufacturing process thereof
  • LED (light-emitting diode) series SMT (surface-mount technology) suction nozzle and manufacturing process thereof
  • LED (light-emitting diode) series SMT (surface-mount technology) suction nozzle and manufacturing process thereof

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Embodiment Construction

[0025] Including mouthpiece 2, mouthpiece 1, core 3, screw 4, spring 5, such as figure 1 , 2 As shown, the nozzle head 1 is a semi-rigid composite material of anti-adhesive material, and the semi-rigid composite material includes Teflon Teflon, polyethylene, and polypropylene are configured in a ratio of 65:25:10 by weight; the core 3 is connected to the nozzle head 1, the spring 5 is covered with the core 3, and the nozzle seat 1 is screwed 4 fixed core 3.

[0026] The mouthpiece 1 is stainless steel 303CU.

[0027] Suction nozzle manufacturing process, including steps,

[0028] 1) mouth making

[0029] a) The ingredients of the semi-rigid composite material are configured according to the ratio of 65:25:10 by weight, and the Teflon Teflon is added to the mixer for baking and melting; then polyethylene and polypropylene are added to the mixer for uniform mixing to form a semi-rigid composite material;

[0030] b) Injection molding, design the injection mold...

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Abstract

The invention discloses an LED (light-emitting diode) series SMT (surface-mount technology) suction nozzle and a manufacturing process thereof. The LED series SMT suction nozzle comprises a nozzle head, a nozzle seat, a core, a screw and a spring, wherein the nozzle head is made of anti-adhesive material, i.e. semi-rigidity composite material, and the semi-rigidity composite material comprises Teflon, polyethylene and polypropylene which are configured in a ratio of 65:25:10 in percentage by weight. The manufacturing process of the suction nozzle comprises the steps of manufacturing the nozzle head; burdening the semi-rigidity composite material: configuring the Teflon, the polyethylene and the polypropylene in the ratio of 65:25:10 in percentage by weight; adding the Teflon into a stirrer for baking and melting; adding the polyethylene and the polypropylene into the stirrer for uniformly stirring for forming the semi-rigidity composite material; injection molding, assembling and assembling the nozzle head and the nozzle seat of the suction nozzle in an interference manner. The LED series SMT suction nozzle solves the problem that the LED is easily adhered to the suction nozzle in the SMT process of the LED, has the characteristics of anti-adhesive property, low reject rate, stable mount quality and capability of effectively protecting the surface of the LED against scratch, and easily realizes industrial production.

Description

technical field [0001] The invention relates to an LED series SMT suction nozzle and a manufacturing process thereof. Background technique [0002] A light-emitting diode (English: Light-Emitting Diode, LED for short) is a semiconductor electronic component that can emit light. SMD LEDs are also called SMD LEDs, which are attached to the surface of circuit boards. They are suitable for SMT processing and can be reflow soldered. SMD LEDs solve problems such as brightness, viewing angle, flatness, reliability, and consistency. Compared with Other packaged devices, it has the advantages of strong vibration resistance, low solder joint defect rate, and good high-frequency characteristics. It packs more LED chips in a smaller area, uses lighter PCB and reflective layer materials, and displays The reflective layer needs to be filled with less epoxy resin. By removing the heavy carbon steel material pins and reducing the size, the weight of the product can be easily reduced by ha...

Claims

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Application Information

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IPC IPC(8): H01L33/00
CPCH01L21/6838
Inventor 冯斌
Owner JIUJIANG JIAYUAN TECH
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