Manufacturing Method Of A Transfer Mold

Abstract

The present invention relates to a manufacturing method of a transfer mold which includes the following steps: (A) providing a transparent substrate, (B) a light solid adhesive layer forming on an upper surface of the transparent substrate, (C) a surface embossing forming on an upper surface of the light solid adhesive layer, and (D) using light source to light the light solid adhesive layer to make the light solid adhesive layer from the transfer mold. Thus, the present invention provides the manufacturing method of the transfer mold which is very simple and reliable to replace familiar steel plates and other coining dies. In addition, from the manufacturing method above, the light solid adhesive layer is further heated after the light solid adhesive layer forming on the upper surface of the transparent substrate to improve the mobility and the uniformity of a colloid, and then, a better flow leveling effect is achieved to make bubbles naturally remove from the colloid, therefore, the formulation of pattern characteristic influenced by bubbles can be effectively avoid to guarantee the integrity of the formed surface stripe.

Description

technical field [0001] The invention relates to a method for manufacturing a transfer printing mold, in particular to a mold that can be used as a transfer printing photocurable adhesive film. Background technique [0002] With the rapid development of science and technology, more and more styles of consumer electronic products have been developed. However, the appearance of a product often becomes one of the main considerations for consumers to purchase. Therefore, the design and development of diversified decorative boards has gradually become one of the key points of the industry. [0003] The shell boards of well-known electronic products are usually attached or painted with decorative stickers, so that the appearance presents different visual feelings. In addition, as the demand for texture increases, metal casing boards are often treated and processed by etching or anodizing. Even, the method of importing the light-cured film made of semiconductors is used to shape ...

AI Technical Summary

Problems solved by technology

However, the leveling agent is mainly a mixture of high-boiling solvents or a polymer or oligomer containing silicone (silicone) is added to the solvent. If the method of increasing the solvent to reduce the viscosity is used to improve the leveling property, it will Decrease the composition of coating solids to affect the flatness of the coating film

On the other hand, if the method of adding a high boiling point solvent to adjust the volatilization rate is used to improve the leveling property, it will cause the disadvantage of relatively prolonged baking time, thereby affecting production efficiency

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