Manufacturing Method Of A Transfer Mold

A manufacturing method and mold technology, which can be used in the field of molds that can be used as transfer photo-curable adhesive films, can solve problems such as the decrease in the solid content of the coating, the influence of the flatness of the coating film, and the prolongation of the baking time, so as to achieve the effect and improve the manufacturing efficiency. , the effect of a simple manufacturing method

Inactive Publication Date: 2014-06-25
JIIN MING IND
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Problems solved by technology

However, the leveling agent is mainly a mixture of high-boiling solvents or a polymer or oligomer containing silicone (silicone) is added to the solvent. If the method of increasing the solvent to reduce the viscosity is used to improve the leveling property, it will Decrease the composition of coating

Method used

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  • Manufacturing Method Of A Transfer Mold
  • Manufacturing Method Of A Transfer Mold
  • Manufacturing Method Of A Transfer Mold

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Embodiment Construction

[0026] In order to enable the examiner to further understand the structure, features and other purposes of the present invention, the accompanying preferred embodiments are now described in detail with the accompanying drawings as follows, and the embodiments illustrated using the accompanying drawings are only used to illustrate the technical solution of the present invention , not to limit the present invention.

[0027] Please also see Figure 1A to Figure 1G and figure 2 , Figure 1A to Figure 1G It is a cross-sectional view of the manufacture of a preferred embodiment of the present invention, figure 2 It is a flow chart of the manufacturing method of a preferred embodiment of the present invention.

[0028] This embodiment includes the following steps: first, step S100, providing a light-transmitting substrate 1, such as Figure 1A shown. Wherein, the transparent substrate 1 may be made of polyethylene terephthalate (PET), polycarbonate (PC), polymethyl methacrylate...

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Abstract

The present invention relates to a manufacturing method of a transfer mold which includes the following steps: (A) providing a transparent substrate, (B) a light solid adhesive layer forming on an upper surface of the transparent substrate, (C) a surface embossing forming on an upper surface of the light solid adhesive layer, and (D) using light source to light the light solid adhesive layer to make the light solid adhesive layer from the transfer mold. Thus, the present invention provides the manufacturing method of the transfer mold which is very simple and reliable to replace familiar steel plates and other coining dies. In addition, from the manufacturing method above, the light solid adhesive layer is further heated after the light solid adhesive layer forming on the upper surface of the transparent substrate to improve the mobility and the uniformity of a colloid, and then, a better flow leveling effect is achieved to make bubbles naturally remove from the colloid, therefore, the formulation of pattern characteristic influenced by bubbles can be effectively avoid to guarantee the integrity of the formed surface stripe.

Description

technical field [0001] The invention relates to a method for manufacturing a transfer printing mold, in particular to a mold that can be used as a transfer printing photocurable adhesive film. Background technique [0002] With the rapid development of science and technology, more and more styles of consumer electronic products have been developed. However, the appearance of a product often becomes one of the main considerations for consumers to purchase. Therefore, the design and development of diversified decorative boards has gradually become one of the key points of the industry. [0003] The shell boards of well-known electronic products are usually attached or painted with decorative stickers, so that the appearance presents different visual feelings. In addition, as the demand for texture increases, metal casing boards are often treated and processed by etching or anodizing. Even, the method of importing the light-cured film made of semiconductors is used to shape ...

Claims

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Application Information

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IPC IPC(8): B44B5/02
Inventor 李静龙顾友信翁芳淇邓丽华
Owner JIIN MING IND
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