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A method, device and control system for obtaining a temperature response curve

A control system, temperature response technology, applied in the computer field, can solve the problem of low precision

Active Publication Date: 2017-06-27
LENOVO (BEIJING) LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Among them, it is currently possible to measure the temperature response curve of the heat-sensitive components in the PCB board affected by the heat source, so that in the design, production and debugging stages of the PCB, technicians can take corresponding measures according to the measured temperature response curve to reduce the impact of the heat source on the heat. The influence of sensitive components, but the accuracy of the temperature response curve of the heat sensitive components measured by the heat source is low

Method used

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  • A method, device and control system for obtaining a temperature response curve
  • A method, device and control system for obtaining a temperature response curve
  • A method, device and control system for obtaining a temperature response curve

Examples

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Embodiment 1

[0032] see figure 1 , an embodiment of the present invention provides a control system, including:

[0033] A control module 1, a heating module 2 and a measurement module 3, the control module 1 is connected to the heating module 2, the heating module 2 transfers heat to the heat sensitive components to be measured, and the measurement module 3 is connected to the heat sensitive components to be measured;

[0034] The control module 1 is used to control the heating module 2 to simulate the working process of the heat source to be measured within a preset time according to the work description information of the heat source to be measured, so that the heating module 2 generates heat and transfers it to the heat sensitive element to be measured Devices, heat sources to be measured include components that are in working condition and generate heat;

[0035] The measurement module 3 is used to measure the temperature index of the heat sensitive component to be measured, and obta...

Embodiment 2

[0057] see figure 2 , an embodiment of the present invention provides a method for obtaining a temperature response curve through the control system shown in Embodiment 1, including:

[0058] Step 101: According to the work description information of the heat source to be measured, control the heating module to simulate the working process of the heat source to be measured within a preset time, so that the heating module generates heat and transfers it to the heat sensitive component to be measured. Heat sources include components that are in working condition and generate heat;

[0059] Step 102: Measure the temperature index of the heat sensitive component to be measured, and obtain the temperature response curve of the heat sensitive component to be measured affected by the heat source to be measured according to the measured temperature index.

[0060] In the embodiment of the present invention, according to the work description information of the heat source to be measu...

Embodiment 3

[0062] On the basis of Embodiment 2, this embodiment of the present invention provides a method for obtaining a temperature response curve through the control system shown in Embodiment 1, see image 3 , the method includes:

[0063] Step 201: the control module acquires work description information of the heat source to be measured, and the work description information is used to describe the working process of the heat source to be measured within a preset time;

[0064] Wherein, the heat source to be measured includes components that are in working state and generate heat; the control module can receive the work description information of the heat source to be measured input by the user.

[0065] Among them, the user can obtain the work description information of the heat source to be measured working within the preset time according to the working process of the heat source to be measured in the PCB within the preset time. If the heat source in the PCB needs to be measured...

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PUM

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Abstract

The invention discloses a method, a device and a control system for obtaining a temperature response curve, belonging to the field of computers. The control system includes: a control module, a heating module and a measurement module, the control module is connected to the heating module, the heating module transfers heat to the thermally sensitive components to be measured, and the measurement module is connected to the to-be-measured heat sensitive component. connected to the heat sensitive components; the control module is configured to control the heating module to simulate the working process of the heat source to be measured within a preset time according to the work description information of the heat source to be measured, so that the heating The module generates heat and transfers it to the thermally sensitive component to be measured; the measurement module is used for measuring the temperature index of the thermally sensitive component to be measured, and obtains the thermally sensitive component to be measured according to the temperature index The temperature response curve of the component affected by the heat source to be measured. The invention improves the accuracy of acquiring the temperature response curve.

Description

technical field [0001] The invention relates to the field of computers, in particular to a method, device and control system for obtaining a temperature response curve. Background technique [0002] As the volume of electronic products becomes smaller and smaller, the functions of PCB (Printed Circuit Board, printed circuit board) products become more and more diverse, which makes more and more components integrated on the PCB board. The influence of heat-sensitive components is increasing, and the heat source on the PCB can be CPU (Central Processing Unit, central processing unit), PA (Power Amplifier, power amplifier) ​​and / or memory, etc. [0003] Among them, it is currently possible to measure the temperature response curve of the heat-sensitive components in the PCB board affected by the heat source, so that in the design, production and debugging stages of the PCB, technicians can take corresponding measures according to the measured temperature response curve to reduc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01K15/00G01N25/00
Inventor 林金强郑煊常程
Owner LENOVO (BEIJING) LTD