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Electromagnetic interference shielding techniques

A circuit board and conductive layer technology, applied in the reduction of crosstalk/noise/electromagnetic interference (, printed circuit, circuit device, etc.), can solve the problem of doubling the vertical space

Active Publication Date: 2014-07-02
APPLE INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, many portable electronic devices have circuitry located on the top and bottom of the PCB, so the vertical space consumed by EMI shielding techniques effectively doubles

Method used

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Embodiment Construction

[0021] The present invention discloses a method and apparatus for manufacturing a printed circuit board (PCB) having electromagnetic interference (EMI) shielding and also having reduced bulk relative to conventional frame and shielding methods. Some embodiments include manufacturing a PCB by mounting an integrated circuit to the PCB, delineating an area corresponding to the integrated circuit with several ground vias, selectively applying an insulating layer over the PCB such that at least one of the ground vias is exposed , and selectively applying a conductive layer over the PCB such that the conductive layer covers at least a portion of the integrated circuit and such that the conductive layer is coupled to at least one of the exposed ground vias.

[0022] Although one or more of the embodiments disclosed herein may be described in detail with reference to particular electronic devices, the embodiments should not be construed or otherwise used to limit the scope of the discl...

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Abstract

Methods and apparatuses are disclosed for fabricating a printed circuit board (PCB) having electromagnetic interference (EMI) shielding and also having reduced volume over conventional frame-and-shield approaches. Some embodiments include fabricating the PCB by mounting an integrated circuit to the PCB, outlining an area corresponding to the integrated circuit with a number of grounded vias, selectively applying an insulating layer over the PCB such that at least one of the grounded vias are exposed, and selectively applying a conductive layer over the PCB such that the conductive layer covers at least a portion of the integrated circuit and such that the conductive layer is coupled to the at least one of the grounded vias that are exposed.

Description

Background technique [0001] I.Technical field [0002] The present invention relates generally to electromagnetic interference (EMI) shielding, and more particularly to EMI shielding techniques that reduce the amount of space consumed and provide substantially the same EMI protection as conventional shielding techniques. [0003] II. Background technology [0004] Electronic devices are ubiquitous in society, and they can be found in everything from portable cellular phones to watches. Many of these electronic devices emit electromagnetic interference (EMI) into their surroundings or are exposed to EMI through their surrounding environment. Since government regulations often dictate the amount of EMI that these electronic devices are allowed to emit, designers of these electronic devices often employ various techniques to minimize the amount of EMI emitted from circuits within the electronic device. Furthermore, since exposure to EMI can be harmful to the circuits in electr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K3/28
CPCH05K2201/09618H05K2201/10371H05K2201/0317H05K3/284Y10T29/49146H05K2201/09909H05K2201/2018H05K2201/09872H05K1/0218Y10T29/4913
Inventor N·G·墨兹王红M·M·尼可欧D·R·派珀C·M·沃纳
Owner APPLE INC